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1. (WO2018062577) SUBSTRATE FOR PRINTED ELECTRONICS AND METHOD OF PRODUCTION THEREFOR, AND PRINTED ELECTRONICS COMPRISING SAME SUBSTRATE AND METHOD OF PRODUCTION THEREFOR
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/062577    International Application No.:    PCT/KR2016/010377
Publication Date: 05.04.2018 International Filing Date: 13.09.2016
IPC:
H01M 10/052 (2010.01), H01M 12/08 (2006.01), H01M 10/054 (2010.01)
Applicants: UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY [KR/KR]; 50, UNIST-gil, Eonyang-eup Ulju-gun Ulsan 44919 (KR)
Inventors: LEE, Sang Young; (KR).
CHOI, Keun Ho; (KR)
Agent: YOU ME PATENT AND LAW FIRM; 115 Teheran-ro, Gangnam-gu, Seoul 06134 (KR)
Priority Data:
10-2016-0114963 07.09.2016 KR
Title (EN) SUBSTRATE FOR PRINTED ELECTRONICS AND METHOD OF PRODUCTION THEREFOR, AND PRINTED ELECTRONICS COMPRISING SAME SUBSTRATE AND METHOD OF PRODUCTION THEREFOR
(FR) SUBSTRAT DESTINÉ À DES COMPOSANTS ÉLECTRONIQUES IMPRIMÉS ET SON PROCÉDÉ DE PRODUCTION, ET COMPOSANT ÉLECTRONIQUE IMPRIMÉ COMPRENANT LEDIT SUBSTRAT ET SON PROCÉDÉ DE PRODUCTION
(KO) 인쇄 전자용 기재 및 이의 제조 방법, 상기 기재를 포함하는 인쇄 전자 및 이의 제조 방법
Abstract: front page image
(EN)The present invention relates to a substrate for printed electronics and a method of production therefor, and a printed electronics comprising the substrate and a method of production therefor. More specifically, the embodiments of the present invention provide techniques for realizing excellent flexibility and various designs by using a substrate with a primer layer formed on the surface thereof to print electronic materials on the primer layer.
(FR)La présente invention concerne un substrat destiné à des composants électroniques imprimés et son procédé de production, et un composant électronique imprimé comprenant ledit substrat et son procédé de production. Plus spécifiquement, les modes de réalisation de la présente invention concernent des techniques permettant d'obtenir une excellente flexibilité et diverses conceptions à l'aide d'un substrat présentant une couche d'apprêt formée sur sa surface afin d'imprimer des matériaux électroniques sur la couche d'apprêt.
(KO)인쇄 전자용 기재 및 이의 제조 방법, 상기 기재를 포함하는 인쇄 전자 및 이의 제조 방법에 관한 것이다. 구체적으로, 본 발명의 구현예들로, 프라이머 층이 표면에 형성된 기재를 사용하여, 상기 프라이머 층 상에 전자 재료를 인쇄함으로써, 우수한 유연성과 다양한 디자인을 구현하는 기술을 제공한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)