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1. (WO2018062513) LED SEALANT COMPOSITION
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Pub. No.: WO/2018/062513 International Application No.: PCT/JP2017/035565
Publication Date: 05.04.2018 International Filing Date: 29.09.2017
IPC:
H01L 33/56 (2010.01) ,C08L 83/05 (2006.01) ,C08L 83/07 (2006.01) ,C09K 3/10 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
10
for sealing or packing joints or covers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants: NISSAN CHEMICAL CORPORATION[JP/JP]; 5-1, Nihonbashi 2-chome, Chuo-ku, Tokyo 1036119, JP
Inventors: SHUTO, Keisuke; JP
KATO, Taku; JP
KOBAYASHI, Junpei; JP
SUZUKI, Masayoshi; JP
Agent: HANABUSA PATENT & TRADEMARK OFFICE; Shin-Ochanomizu Urban Trinity, 2, Kandasurugadai 3-chome, Chiyoda-ku, Tokyo 1010062, JP
Priority Data:
2016-19463330.09.2016JP
Title (EN) LED SEALANT COMPOSITION
(FR) COMPOSITION DE MATÉRIAU D’ENCAPSULATION POUR DEL
(JA) LED用封止材組成物
Abstract:
(EN) [Problem] To provide: an LED sealant composition; a cured product obtained by curing said LED sealant composition; and an LED device having an LED element sealed with said cured product. [Solution] This LED sealant composition comprises (A) a linear organopolysiloxane that has at least two alkenyl groups bound to a silicon atom per molecule and that has three types of structural units represented by formula (1): (R1R2R3SiO1/2)a(R4R5SiO2/2)b(R62SiO2/2)c, (B) a linear organopolysiloxane that has at least two hydrogen atoms bound to a silicon atom per molecule and that has three types of structural units represented by formula (2): (R7R8R9SiO1/2)d(R10R11SiO2/2)e(R122SiO2/2)f, and (C) a hydrosilylation catalyst, wherein R4 in formula (1) and/or R10 in formula (2) represents a biphenylyl group.
(FR) L’invention fournit une composition de matériau d’encapsulation pour DEL, un produit durci obtenu par durcissement de cette composition, et un dispositif de DEL dans lequel un élément DEL est encapsulé au moyen dudit produit durci. La composition de matériau d’encapsulation pour DEL de l’invention contient (A) un organopolysiloxane à chaîne droite possédant trois sortes d’unités structurales représentées par la formule (1), et possédant au moins trois groupes alcényle liés à un atome de silicium dans chaque molécule (RSiO1/2(RSiO2/2(R SiO2/2 (1), (B) un organopolysiloxane à chaîne droite possédant trois sortes d’unités structurales représentées par la formule (2), et possédant au moins deux atomes d’hydrogène liés à un atome de silicium dans chaque molécule (RSiO1/2(R1011SiO2/2(R12 SiO2/2(2), et (C) un catalyseur de réaction d’hydrosilylation. R dans ladite formule (1) et/ou R10 dans ladite formule (2) représente un groupe biphénylyle.
(JA) 【課題】LED用封止材組成物、当該組成物を硬化して得られる硬化物、及び当該硬化物によりLED素子が封止されたLED装置の提供。 【解決手段】(A)下記式(1)で表される3種の構造単位を有し、ケイ素原子と結合したアルケニル基を1分子中に少なくとも2個有する直鎖状のオルガノポリシロキサン、 (RSiO1/2(RSiO2/2(RSiO2/2 (1) (B)下記式(2)で表さる3種の構造単位を有し、ケイ素原子と結合した水素原子を1分子中に少なくとも2個有する直鎖状のオルガノポリシロキサン、 (RSiO1/2(R1011SiO2/2(R12SiO2/2f (2) 及び (C)ヒドロシリル化反応触媒 を含み、前記式(1)中のRおよび前記式(2)中のR10の少なくとも一方はビフェニリル基を表す、LED用封止材組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)