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1. (WO2018062482) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE

Pub. No.:    WO/2018/062482    International Application No.:    PCT/JP2017/035469
Publication Date: Fri Apr 06 01:59:59 CEST 2018 International Filing Date: Sat Sep 30 01:59:59 CEST 2017
IPC: H01L 21/60
H01L 25/065
H01L 25/07
H01L 25/18
Applicants: SHINKAWA LTD.
株式会社新川
Inventors: NAKAMURA Tomonori
中村 智宣
MAEDA Toru
前田 徹
Title: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE
Abstract:
A mounting method for laminating and mounting a specified target lamination number of semiconductor chips 10 on a substrate 30 includes: a first lamination step for laminating while temporarily crimping one or more semiconductor chips 10 on the substrate 30 to thereby form a first chip laminate body ST1; a first permanent crimping step for applying pressure while heating from the upper side of the first chip laminate body ST1 to thereby collectively and permanently crimp the one or more semiconductor chips 10; a second lamination step for sequentially laminating while temporarily crimping two or more semiconductor chips 10 on the permanently crimped semiconductor chips 10 to thereby form a second chip laminate body ST2; and a second permanent crimping step for applying pressure while heating from the upper side of the second chip laminate body ST2 to thereby collectively and permanently crimp the two or more semiconductor chips 10.