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1. (WO2018062405) CURED BODY AND MULTILAYERED SUBSTRATE
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Pub. No.: WO/2018/062405 International Application No.: PCT/JP2017/035274
Publication Date: 05.04.2018 International Filing Date: 28.09.2017
IPC:
C08L 63/00 (2006.01) ,C08K 3/00 (2006.01) ,C08L 79/08 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/46 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP/JP]; 大阪府大阪市北区西天満2丁目4番4号 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
Inventors:
林 達史 HAYASHI, Tatsushi; JP
西村 貴至 NISHIMURA, Takashi; JP
馬場 奨 BABA, Susumu; JP
Agent:
特許業務法人 宮▲崎▼・目次特許事務所 MIYAZAKI & METSUGI; 大阪府大阪市中央区常盤町1丁目3番8号 中央大通FNビル Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2016-19167729.09.2016JP
Title (EN) CURED BODY AND MULTILAYERED SUBSTRATE
(FR) CORPS DURCI ET SUBSTRAT MULTICOUCHE
(JA) 硬化体及び多層基板
Abstract:
(EN) Provided is a cured body capable of improving adhesion between an insulation layer and a metal layer and reducing surface roughness of the surface of the insulation layer. This cured body is a cured body of a resin composition including an epoxy compound, a curing agent, an inorganic filler, and a polyimide, the content of the inorganic filler in 100 wt.% of the cured body is 30 to 90 wt.% (inclusive), the cured body has a sea-island structure having sea parts and island parts, the average major axis of the island parts is 5 μm or less, and the island parts include the polyimide.
(FR) L'invention concerne un corps durci pouvant améliorer l'adhérence entre une couche d'isolation et une couche métallique et réduire la rugosité de la surface de la couche d'isolation. Ce corps durci est un corps durci d'une composition de résine comprenant un composé époxy, un agent de durcissement, une charge inorganique et un polyimide, la teneur en charge inorganique dans 100 % en poids du corps durci étant de 30-90 % en poids (valeurs extrêmes incluses), le corps durci présentant une structure de mer-île présentant des parties de mer et des parties d'île, le grand axe moyen des parties d'île étant de 5 µm ou moins et les parties d'île comprenant le polyimide.
(JA) 絶縁層と金属層との密着性を高め、かつ絶縁層の表面の表面粗さを小さくすることができる硬化体を提供する。 本発明に係る硬化体は、エポキシ化合物と硬化剤と無機充填材とポリイミドとを含む樹脂組成物の硬化体であり、前記硬化体100重量%中、前記無機充填材の含有量が30重量%以上、90重量%以下であり、前記硬化体は、海部と島部とを有する海島構造を有し、前記島部の平均長径が5μm以下であり、前記島部が前記ポリイミドを含む。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)