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1. (WO2018062172) THERMALLY CONDUCTIVE, THERMALLY EXPANDABLE RESIN COMPOSITION, THERMALLY CONDUCTIVE, THERMALLY EXPANDABLE MOLDED BODY, BATTERY MODULE, AND BATTERY PACK
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/062172    International Application No.:    PCT/JP2017/034728
Publication Date: 05.04.2018 International Filing Date: 26.09.2017
IPC:
C09K 5/14 (2006.01), C08K 3/00 (2006.01), C08L 101/12 (2006.01), H01M 10/613 (2014.01), H01M 10/643 (2014.01), H01M 10/647 (2014.01), H01M 10/651 (2014.01), H01M 10/6551 (2014.01), H01M 10/6555 (2014.01), H01M 10/6561 (2014.01), H01M 10/658 (2014.01)
Applicants: SEKISUI CHEMICAL CO., LTD. [JP/JP]; 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565 (JP)
Inventors: IWANE, Kazuyoshi; (JP).
YAMAGATA, Masahiko; (JP)
Agent: SAEGUSA & PARTNERS; Kitahama TNK Building, 1-7-1, Doshomachi, Chuo-ku, Osaka-shi, Osaka 5410045 (JP)
Priority Data:
2016-194655 30.09.2016 JP
2017-124759 27.06.2017 JP
Title (EN) THERMALLY CONDUCTIVE, THERMALLY EXPANDABLE RESIN COMPOSITION, THERMALLY CONDUCTIVE, THERMALLY EXPANDABLE MOLDED BODY, BATTERY MODULE, AND BATTERY PACK
(FR) COMPOSITION DE RÉSINE THERMIQUEMENT CONDUCTRICE, THERMIQUEMENT EXPANSIBLE, CORPS MOULÉ THERMIQUEMENT CONDUCTEUR, THERMIQUEMENT EXPANSIBLE, MODULE DE BATTERIE ET BLOC-BATTERIE
(JA) 熱伝導性熱膨張性樹脂組成物、熱伝導性熱膨張性成形体、バッテリーモジュール、及びバッテリーパック
Abstract: front page image
(EN)This thermally conductive, thermally expandable resin composition has a heat conductivity at -30 to 80°C of 1 W/m∙K or more, starts expansion at temperatures exceeding 80°C, and has a thermal conductivity of 0.5 W/m∙K or less.
(FR)Cette composition de résine thermiquement conductrice et thermiquement expansible a une conductivité thermique dans des conditions de température de -30 à 80 °C de 1 W/m ∙ K ou plus, commence l'expansion à des températures dépassant 80 °C, et présente une conductivité thermique de 0,5 W/m ∙ K ou moins.
(JA)熱伝導性熱膨張性樹脂組成物は、-30℃~80℃において熱伝導率1W/m・K以上を有し、80℃を超える温度で膨張を開始し、熱膨張後には熱伝導率0.5W/m・K以下を有する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)