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1. (WO2018062129) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE

Pub. No.:    WO/2018/062129    International Application No.:    PCT/JP2017/034640
Publication Date: Fri Apr 06 01:59:59 CEST 2018 International Filing Date: Wed Sep 27 01:59:59 CEST 2017
IPC: H01L 21/52
Applicants: SHINKAWA LTD.
株式会社新川
Inventors: SEYAMA, Kohei
瀬山 耕平
Title: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE
Abstract:
The method for manufacturing a semiconductor device includes: a placing step for placing, on a bonding surface (51), a temporary substrate (300) which is transmissive with respect to an alignment mark (52); an image acquisition step for acquiring an image (51) of the alignment mark and an image of a semiconductor die (200); a correction step for correcting, on the basis of the image of the alignment mark (300) and the image of the semiconductor die (200) acquired in the image acquisition step, the position in the horizontal direction of a bonding head (30) that pressure bonds the semiconductor die (200) to the temporary substrate (300); and a pressure bonding step for pressure bonding the semiconductor die (200) to the transmissive substrate (300) on the basis of the corrected position in the horizontal direction. A method for manufacturing a semiconductor device, which can suppress variation in the spacing between semiconductor dies arranged on a temporary substrate, and a mounting device are thereby provided.