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1. (WO2018062056) MOUNTING STRUCTURE OF PIEZOELECTRIC BASE MATERIAL, AND SENSOR MODULE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/062056    International Application No.:    PCT/JP2017/034392
Publication Date: 05.04.2018 International Filing Date: 22.09.2017
IPC:
G01L 1/16 (2006.01), H01L 41/053 (2006.01), H01L 41/087 (2006.01), H01L 41/113 (2006.01), H01L 41/193 (2006.01)
Applicants: MITSUI CHEMICALS, INC. [JP/JP]; 5-2, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo 1057117 (JP)
Inventors: YOSHIDA, Mitsunobu; (JP).
TANIMOTO, Kazuhiro; (JP).
MITSUZAKA, Masahiko; (JP)
Agent: NAKAJIMA, Jun; (JP).
KATO, Kazuyoshi; (JP).
FUKUDA, Koji; (JP)
Priority Data:
2016-188600 27.09.2016 JP
Title (EN) MOUNTING STRUCTURE OF PIEZOELECTRIC BASE MATERIAL, AND SENSOR MODULE
(FR) STRUCTURE DE MONTAGE DE MATÉRIAU DE BASE PIÉZOÉLECTRIQUE, ET MODULE DE CAPTEUR
(JA) 圧電基材の取付構造及びセンサモジュール
Abstract: front page image
(EN)The present invention has: a cable-shaped piezoelectric base material; a pressurization section, which is provided adjacent to the piezoelectric base material, and is to be pressurized from the side opposite to the piezoelectric base material; and a base section, which is adjacent to the piezoelectric base material, and is provided on the side facing the pressurization section. The ratio Eb/Ea between the Young's modulus Ea of the pressurization section and the Young's modulus Eb of the base section is equal to or lower than 10-1.
(FR)La présente invention concerne un matériau de base piézoélectrique en forme de câble ; une section de mise sous pression, disposée de façon adjacente au matériau de base piézoélectrique, et devant être pressurisé depuis le côté opposé au matériau de base piézoélectrique ; et une section de base, adjacente au matériau de base piézoélectrique, et disposée sur le côté faisant face à la section de mise sous pression. Le rapport Eb/Ea entre le module d'Young Ea de la section de mise sous pression et le module d'Young Eb de la section de base est égal ou inférieur à 10-1.
(JA)ケーブル状の圧電基材と、前記圧電基材に隣接して設けられ、かつ前記圧電基材の対向側から加圧される加圧部と、前記圧電基材に隣接し、かつ前記加圧部の対向側に設けられた基部と、を有している。そして、前記加圧部のヤング率Eaと、前記基部のヤング率Ebとの比Eb/Eaは10-1以下となる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)