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1. (WO2018061982) SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Pub. No.:    WO/2018/061982    International Application No.:    PCT/JP2017/034112
Publication Date: Fri Apr 06 01:59:59 CEST 2018 International Filing Date: Fri Sep 22 01:59:59 CEST 2017
IPC: H01L 25/065
H01L 25/07
H01L 25/18
Applicants: DEXERIALS CORPORATION
デクセリアルズ株式会社
Inventors: MORI, Daichi
森 大地
Title: SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Abstract:
Provided is a semiconductor device manufacturing method that enables suppression of curing retardation when a laminatedly disposed semiconductor chip group is pressed by a thermocompression bonding tool, whereby good bonding performance can be obtained. The semiconductor chip group formed of a first thermosetting adhesive disposed below a first semiconductor chip which is the uppermost layer, extending to an m-th (m is an integer not smaller than 3) thermosetting adhesive disposed below an m-th semiconductor chip which is the lowermost layer, is disposed on an interposer. The minimum melt viscosity reaching temperature of the first thermosetting adhesive is not lower than any of the minimum melt viscosity reaching temperatures of the second to m-th thermosetting adhesives. The minimum melt viscosity reaching temperature of at least one of the second to m-th thermosetting adhesives is lower than the minimum melt viscosity reaching temperature of the first thermosetting adhesive.