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1. (WO2018061945) MEASURING SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND DEVICE MANUFACTURING METHOD
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Pub. No.: WO/2018/061945 International Application No.: PCT/JP2017/033954
Publication Date: 05.04.2018 International Filing Date: 20.09.2017
IPC:
G03F 9/00 (2006.01) ,G01B 21/00 (2006.01) ,G03F 7/20 (2006.01) ,H01L 21/68 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
9
Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
21
Measuring arrangements or details thereof in so far as they are not adapted to particular types of measuring means of the other groups of this subclass
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
Applicants: NIKON CORPORATION[JP/JP]; 15-3, Konan 2-chome, Minato-ku, Tokyo 1086290, JP
Inventors: ICHINOSE, Go; JP
DOSHO, Tomonori; JP
Agent: TATEISHI, Atsuji; JP
Priority Data:
2016-19281030.09.2016JP
Title (EN) MEASURING SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND DEVICE MANUFACTURING METHOD
(FR) SYSTÈME DE MESURE, SYSTÈME DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE FABRICATION DE DISPOSITIF
(JA) 計測システム及び基板処理システム、並びにデバイス製造方法
Abstract:
(EN) A measuring system (5001) to be used on the production line of a micro device is independently provided from an exposure apparatus. The measuring system (5001) is provided with: a plurality of measuring apparatuses (1001-1003), which respectively measure substrates (for instance, substrates having been subjected to at least one process but before being coated with a sensitive agent); and a transfer system for receiving/delivering the substrates from/to the measuring apparatuses. The measuring apparatuses include: the first measuring apparatus (1001) that acquires, by being set to first conditions, the positional information of a plurality of marks formed on the substrates; and the second measuring apparatus (1002) that acquires, by being set to the first conditions, the positional information of marks formed on another substrate (for instance, another substrate included in the lot of the substrate, the positional information of which is to be acquired by means of the first measuring device set to the first conditions).
(FR) Un système de mesure (5001) à utiliser sur la ligne de production d'un micro-dispositif est obtenu indépendamment à partir d'un appareil d'exposition. Le système de mesure (5001) comprend : une pluralité d'appareils de mesure (1001-1003) qui mesurent respectivement des substrats (par exemple, des substrats ayant été soumis à au moins un traitement, mais avant d'être revêtus d'un agent sensible); et un système de transfert permettant de recevoir les substrats provenant des appareils de mesure et de les diriger vers ces derniers. Les appareils de mesure comprennent : le premier appareil de mesure (1001) qui acquiert, comme défini selon des premières conditions, les informations de position d'une pluralité de marques formées sur les substrats; et le second appareil de mesure (1002) qui acquiert, comme défini selon les premières conditions, les informations de position de marques formées sur un autre substrat (par exemple, un autre substrat inclus dans l'ensemble du substrat, dont les informations de position doivent être acquises au moyen du premier dispositif de mesure défini selon les premières conditions).
(JA) マイクロデバイスの製造ラインで用いられる計測システム(500)は、露光装置とは独立して設けられている。計測システム(500)は、それぞれ基板(例えば少なくとも1つのプロセス処理を経た後、感応剤が塗布される前の基板)に対する計測処理を行なう複数の計測装置(100~100)と、複数の計測装置と基板の受け渡しを行うための搬送システムと、を備えている。複数の計測装置は、基板に形成された複数のマークの位置情報を第1条件の設定の下で取得する第1計測装置(100)と、別の基板(例えば、第1計測装置において第1条件の設定の下で位置情報の取得が行われる基板と同一のロットに含まれる別の基板)に形成された複数のマークの位置情報を第1条件の設定の下で取得する第2計測装置(100)と、を含む。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)