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1. (WO2018061582) TREATMENT FLUID AND METHOD FOR TREATING LAMINATE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/061582    International Application No.:    PCT/JP2017/031042
Publication Date: 05.04.2018 International Filing Date: 30.08.2017
IPC:
H01L 21/306 (2006.01), C11D 3/04 (2006.01), C11D 3/20 (2006.01), C11D 3/34 (2006.01), C11D 3/36 (2006.01), C11D 3/37 (2006.01), C11D 3/43 (2006.01), C11D 7/00 (2006.01), C11D 7/08 (2006.01), C11D 7/22 (2006.01), C11D 7/26 (2006.01), C11D 7/34 (2006.01), C11D 7/36 (2006.01), C11D 7/50 (2006.01), C11D 17/08 (2006.01), H01L 21/304 (2006.01), H01L 21/768 (2006.01), C11D 3/02 (2006.01), C11D 7/02 (2006.01)
Applicants: FUJIFILM CORPORATION [JP/JP]; 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620 (JP)
Inventors: KAMIMURA Tetsuya; (JP)
Agent: NAKASHIMA Junko; (JP).
YONEKURA Junzo; (JP).
MURAKAMI Yasunori; (JP)
Priority Data:
2016-192210 29.09.2016 JP
Title (EN) TREATMENT FLUID AND METHOD FOR TREATING LAMINATE
(FR) FLUIDE DE TRAITEMENT ET PROCÉDÉ DE TRAITEMENT DE STRATIFIÉ
(JA) 処理液および積層体の処理方法
Abstract: front page image
(EN)The present invention addresses the problem of providing a treatment fluid that can inhibit etching on an insulating film while exhibiting an excellent ability to remove a metal hard mask and residues thereof, and of providing a method for treating a laminate. The treatment fluid according to the present invention is a treatment fluid for semiconductor devices, said treatment fluid having a pH of not more than 5 and containing a fluorine-containing compound and a water-soluble aromatic compound that does not have a heterocyclic group but has a benzene ring.
(FR)La présente invention aborde le problème consistant à fournir un fluide de traitement qui peut inhiber la gravure sur un film isolant tout en présentant une excellente aptitude à éliminer un masque dur métallique et des résidus de celui-ci, et à fournir un procédé de traitement d'un stratifié. Le fluide de traitement selon la présente invention est un fluide de traitement pour dispositifs à semi-conducteurs, ledit fluide de traitement ayant un pH inférieur ou égal à 5 et contenant un composé contenant du fluor et un composé aromatique soluble dans l'eau qui n'a pas de groupe hétérocyclique mais a un cycle benzénique.
(JA)本発明の課題は、メタルハードマスクおよびこれの残渣物の除去性に優れつつ、絶縁膜のエッチングを抑制できる処理液、および、積層体の処理方法を提供することである。本発明の処理液は、半導体デバイス用の処理液であって、含フッ素化合物と、複素環基を有さずベンゼン環を有する水溶性芳香族化合物と、を含有し、pHが5以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)