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1. (WO2018061336) SUBSTRATE PLACEMENT STAGE, AND SUBSTRATE PLACEMENT STAGE FABRICATION METHOD

Pub. No.:    WO/2018/061336    International Application No.:    PCT/JP2017/021788
Publication Date: Fri Apr 06 01:59:59 CEST 2018 International Filing Date: Wed Jun 14 01:59:59 CEST 2017
IPC: H01L 21/683
C23C 14/50
C23C 16/458
C23C 16/46
H01L 21/3065
H01L 21/31
H05H 1/46
Applicants: NHK SPRING CO., LTD.
日本発條株式会社
Inventors: TACHIKAWA Toshihiro
立川 俊洋
AIKAWA Naoya
相川 尚哉
TAKAHARA Go
▲高▼原 剛
SUZUKI Kohei
鈴木 恒平
MITSUDA Hiroshi
光田 拓史
Title: SUBSTRATE PLACEMENT STAGE, AND SUBSTRATE PLACEMENT STAGE FABRICATION METHOD
Abstract:
Provided are a stage for precisely controlling the temperature of a substrate, and a method for fabricating the stage. Also provided are a film forming device having the stage, and a film processing device . The stage for placing a substrate comprises a base material, and a heater layer on the base material; the heater layer has a first insulating film, a heater wire over the first insulating film, and a second insulating film over the heater wire; and the heater wire contains at least one type of metal selected from tungsten, nickel, chromium, cobalt, and molybdenum.