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Machine translation
1. (WO2018060233) COMPONENT CARRIER WITH FULLY ENCAPSULATED THERMOELECTRIC DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/060233    International Application No.:    PCT/EP2017/074472
Publication Date: 05.04.2018 International Filing Date: 27.09.2017
IPC:
H01L 35/32 (2006.01), H05K 1/02 (2006.01)
Applicants: AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT [AT/AT]; Fabriksgasse 13 8700 Leoben (AT)
Inventors: SILVANO DE SOUSA, Jonathan; (AT)
Agent: DILG, Andreas; (DE)
Priority Data:
10 2016 118 271.0 27.09.2016 DE
Title (EN) COMPONENT CARRIER WITH FULLY ENCAPSULATED THERMOELECTRIC DEVICE
(FR) SUPPORT DE COMPOSANT DOTÉ D'UN DISPOSITIF THERMOÉLECTRIQUE ENTIÈREMENT ENCAPSULÉ
Abstract: front page image
(EN)A component carrier ( 100) which comprises a heat absorbing and thermally conductive surface layer (102) configured for being heated by an external heat source (104), and a thermoelectric device (106) fully surrounded by material of the component carrier (100), thermally coupled with the surface layer (102) and configured for transferring thermal energy of the heated surface layer (102) into electric energy.
(FR)La présente invention concerne un support de composant (100) qui comprend une couche de surface thermiquement absorbante et thermiquement conductrice (102) conçue pour être chauffée par une source de chaleur externe (104), et un dispositif thermoélectrique (106) entièrement entourée par un matériau du support de composant (100), couplé thermiquement à la couche de surface (102) et conçu pour transférer l'énergie thermique de la couche de surface chauffée (102) en énergie électrique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)