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1. (WO2018059373) BATCH BONDING APPARATUS AND BONDING METHOD
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Pub. No.: WO/2018/059373 International Application No.: PCT/CN2017/103330
Publication Date: 05.04.2018 International Filing Date: 26.09.2017
IPC:
H01L 21/67 (2006.01) ,H01L 21/60 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
上海微电子装备(集团)股份有限公司 SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD. [CN/CN]; 中国上海市 张江高科技园区张东路1525号 1525 Zhangdong Road Zhangjiang High-Tech Park Shanghai 201203, CN
Inventors:
姜晓玉 JIANG, Xiaoyu; CN
夏海 XIA, Hai; CN
陈飞彪 CHEN, Feibiao; CN
郭耸 GUO, Song; CN
Agent:
上海思微知识产权代理事务所(普通合伙) SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY; 中国上海市 长宁区天山西路789号1幢341室 Room 341, Building 1 789 West Tianshan Road, Changning District Shanghai 200335, CN
Priority Data:
201610876747.230.09.2016CN
Title (EN) BATCH BONDING APPARATUS AND BONDING METHOD
(FR) APPAREIL DE COLLAGE DE LOT ET PROCÉDÉ DE COLLAGE
(ZH) 一种批处理键合装置及键合方法
Abstract:
(EN) A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit (10) for providing a chip (60) to be bonded; a substrate supply unit (20) for providing a substrate; a transfer unit (40) for transferring the chip (60) between the chip supply unit (10) and the substrate supply unit (20); and a pickup unit (30) disposed above the chip supply unit (10), for picking up the chip (60) from the chip supply unit (10) and uploading the chip (60) to the transfer unit (40) after flipping a marked surface of the chip (60) in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.
(FR) La présente invention concerne un appareil de collage de lot et un procédé de collage. L'appareil de collage comprend : une unité d'alimentation de puce (10) pour alimenter une puce (60) à coller ; une unité d'alimentation de substrat (20) pour alimenter un substrat ; une unité de transfert (40) pour transférer la puce (60) entre l'unité d'alimentation de puce (10) et l'unité d'alimentation de substrat (20) ; et une unité de capture (30) disposée au-dessus de l'unité d'alimentation de puce (10), pour saisir la puce (60) à partir de l'unité d'alimentation de puce (10) et charger la puce (60) vers l'unité de transfert (40) après le retournement d'une surface marquée de la puce (60) dans une direction requise. Dans la présente invention, la capture de chaque puce est réalisée individuellement, mais des processus de transfert et des processus de liaison peuvent être effectués pour de multiples puces en même temps, ce qui augmente considérablement le rendement.
(ZH) 一种批处理键合装置及键合方法,键合装置包括:芯片供应单元(10),用于提供待键合的芯片(60);基底供应单元(20),用于提供基底;传送单元(40),用于在芯片供应单元(10)以及基底供应单元(20)之间移送芯片(60);拾取单元(30),设置于芯片供应单元(10)上方,用于从芯片供应单元(10)拾取芯片(60),并将芯片(60)的标记面翻转至所需方向后上载至传送单元(40)。由此单独完成每个芯片的拾取,但传送过程和键合过程中,多个芯片可同时完成,大大增加了产率。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)