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1. (WO2018058925) LASER SPRAY SOLDERING NOZZLE, AND SPRAY SOLDERING DEVICE AND METHOD

Pub. No.:    WO/2018/058925    International Application No.:    PCT/CN2017/078816
Publication Date: Fri Apr 06 01:59:59 CEST 2018 International Filing Date: Fri Mar 31 01:59:59 CEST 2017
IPC: B23K 26/14
Applicants: SHENZHEN ANEWBEST ELECTRONIC TECHNOLOGY CO., LTD.
深圳市艾贝特电子科技有限公司
Inventors: TAN, Zhengdong
檀正东
WANG, Haiying
王海英
ZHOU, Xuan
周旋
Title: LASER SPRAY SOLDERING NOZZLE, AND SPRAY SOLDERING DEVICE AND METHOD
Abstract:
A laser spray soldering nozzle and a spray soldering device. The laser spray soldering nozzle comprises a spray soldering nozzle body (1) having a cavity (10); the spray soldering nozzle body (1) is provided with a gas supply port (13), a tin feeding hole (11), and a nozzle (12) communicated with the spray soldering nozzle cavity (10). The spray soldering device comprises a laser (2), a spray soldering nozzle, a pressure supply mechanism (4), a tin feeding mechanism (3) connected to the spray soldering nozzle, and a spray soldering controller for coordinating operations of the tin feeding mechanism, the pressure supply mechanism, and the laser; the spray soldering nozzle body (1) is provided with the gas supply port (13), the tin feeding hole (11), and the nozzle (12) communicated with the cavity; the gas supply port (13) is connected to the pressure supply mechanism (4); the tin feeding mechanism (3) is connected to the tin feeding hole (11). A spray soldering method of the spray soldering device comprises: first placing a solder ball A in the spray soldering nozzle; when the solder ball A is located at the entrance of the nozzle (12), starting to heat the solder ball A with laser; when the solder ball A is heated to melt, ejecting pressurized gas onto the molten solder ball A, to make the molten solder ball A be sprayed out of the exit of the nozzle (12) towards a soldering point. When the laser spray soldering nozzle is operating, the solder ball undergoes a free-fall movement in the nozzle, thereby preventing residuals on the nozzle caused when molten soldering tin obtained after a solder ball is molten contacts the nozzle, so that the nozzle clogging phenomenon is reduced.