Processing

Please wait...

Settings

Settings

Goto Application

1. WO2018058923 - THREE-DIMENSIONAL LED PACKAGE MODULE WITH ANNULAR FILAMENTS AND PREPARATION METHOD THEREFOR

Publication Number WO/2018/058923
Publication Date 05.04.2018
International Application No. PCT/CN2017/078713
International Filing Date 30.03.2017
IPC
H01L 21/98 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
98Assembly of devices consisting of solid state components formed in or on a common substrate; Assembly of integrated circuit devices
H01L 25/13 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10the devices having separate containers
13the devices being of a type provided for in group H01L33/78
H01L 33/48 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/62 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
CPC
H01L 25/13
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
10the devices having separate containers
13the devices being of a type provided for in group H01L33/00
H01L 33/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applicants
  • 王定锋 WANG, Dingfeng [CN]/[CN]
Inventors
  • 王定锋 WANG, Dingfeng
  • 徐文红 XU, Wenhong
Agents
  • 深圳壹舟知识产权代理事务所(普通合伙) SHENZHEN ARK INTELLECTUAL PROPERTY AGENT LLP
Priority Data
201610883609.730.09.2016CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) THREE-DIMENSIONAL LED PACKAGE MODULE WITH ANNULAR FILAMENTS AND PREPARATION METHOD THEREFOR
(FR) MODULE BOÎTIER DEL TRIDIMENSIONNEL À FILAMENTS ANNULAIRES ET SON PROCÉDÉ DE PRÉPARATION
(ZH) 一种带环形灯丝的立体LED封装模组及制作方法
Abstract
(EN) A three-dimensional LED package module with annular filaments and a preparation method therefor. A metal strip is die-cut into a rudiment of an annular filament holder (1) comprising multiple interconnected units for two or more LEDs; metal connectors (1.6a, 1.6b) are provided between rings (1.1, 1.2, 1.3) of each unit for supporting or/and electrical connection; after electroplating and injection molding, each ring is reinforced using plastic, and loop circuits are connected by means of a plastic insulator (2) at the disconnected position; an LED chip (3) is packaged on each ring and is connected to the metal loop circuit by means of a solder wire (4); in each unit, the rings are connected in series, or in parallel, or in a combined mode of series and parallel connections; the LED filament package module with the multiple interconnected units is divided into multiple single units, and the multiple annular rings in the unit are drawn apart along an axial direction, so as to form a three-dimensional LED package module with an annular filament. The filament package module has good heat conduction and dissipation performance, emits uniform light on multiple surfaces, and has high luminous flux and luminous efficacy.
(FR) L'invention concerne un module boîtier DEL tridimensionnel à filaments annulaires et son procédé de préparation. Une bande métallique est découpée à l'emporte-pièce en un support de filaments annulaire (1) rudimentaire comprenant de multiples unités interconnectées pour au moins deux DEL. Des connecteurs métalliques (1.6a, 1.6b) sont ménagés entre des anneaux (1.1, 1.2, 1.3) de chaque unité pour servir de support et/ou de raccordement électrique. Après électrodéposition et moulage par injection, chaque anneau est renforcé avec du plastique, et des circuits en boucle sont connectés au moyen d'un isolant en plastique (2) à la position de déconnexion. Une puce DEL (3) est encapsulée sur chaque anneau et reliée au circuit en boucle métallique par un fil de soudure (4). Dans chaque unité, les anneaux sont connectés en série, ou en parallèle, ou en mode combiné série-parallèle. Le module boîtier à filaments DEL muni des multiples unités interconnectées est divisé en plusieurs unités individuelles, et les multiples anneaux annulaires présents dans l'unité sont espacés le long d'une direction axiale de façon à former un module boîtier DEL tridimensionnel à filaments annulaires. Le module boîtier à filaments présente de bonnes performances de conduction et de dissipation thermiques, émet une lumière uniforme sur de multiples surfaces, et présente un flux lumineux et une efficacité lumineuse élevés.
(ZH) 一种带环形灯丝的立体LED封装模组及制作方法,将金属带冲切成多个单元互相连在一起的两个或两个以上的LED多个环形灯丝支架(1)雏形,每单元内环与环(1.1、1.2、1.3)之间有起作支撑或/和电路连接作用的金属连接体(1.6a、1.6b),电镀后注塑,使每个环用塑料加固,同时也使环电路的断开处用塑料绝缘体(2)连接在一起,在每个环上封装LED芯片(3),LED芯片通过焊线(4)连接到金属环电路上,单元内环与环之间形成串联、或并联、串并混联组合连接,然后把多个单元连接在一起的LED灯丝封装模组拆分成单个单元,再把单元内的多个圆环沿着轴向方向拉开,制作成带环形灯丝的立体LED封装模组。这种灯丝封装模组导热散热好、多面发光均匀、光通量高,光效高。
Related patent documents
Latest bibliographic data on file with the International Bureau