Search International and National Patent Collections

1. (WO2018057651) THERMAL DISTRIBUTION ASSEMBLY IN AN ELECTRONIC DEVICE

Pub. No.:    WO/2018/057651    International Application No.:    PCT/US2017/052562
Publication Date: Fri Mar 30 01:59:59 CEST 2018 International Filing Date: Thu Sep 21 01:59:59 CEST 2017
IPC: H05K 7/20
H05K 5/00
H04M 1/02
Applicants: APPLE INC.
Inventors: JARVIS, Daniel W.
PAKULA, David A.
DUNSMOOR, David J.
SPRAGGS, Ian A.
HOOTON, Lee E.
RAMMAH, Marwan
HILL, Matthew D.
MEYER, Robert F.
BERTIN, James A.
HELMORE, Simon C.
WAH, Melissa A.
HOUSOUR, Jon F.
FOURNIER, Douglas G.
TOMASETTA, Christopher S.
BENNETT, Eric M.
Title: THERMAL DISTRIBUTION ASSEMBLY IN AN ELECTRONIC DEVICE
Abstract:
A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.