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1. (WO2018057400) HIGH DENSITY MEMORY MODULE SYSTEM
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Pub. No.: WO/2018/057400 International Application No.: PCT/US2017/051669
Publication Date: 29.03.2018 International Filing Date: 14.09.2017
IPC:
G11C 5/04 (2006.01) ,G11C 7/10 (2006.01)
G PHYSICS
11
INFORMATION STORAGE
C
STATIC STORES
5
Details of stores covered by group G11C11/63
02
Disposition of storage elements, e.g. in the form of a matrix array
04
Supports for storage elements; Mounting or fixing of storage elements on such supports
G PHYSICS
11
INFORMATION STORAGE
C
STATIC STORES
7
Arrangements for writing information into, or reading information out from, a digital store
10
Input/output (I/O) data interface arrangements, e.g. I/O data control circuits, I/O data buffers
Applicants:
SMART MODULAR TECHNOLOGIES, INC. [US/US]; 39870 Eureka Drive Newark, California 94560-4809, US
Inventors:
IYER, Satyanarayan Shivkumar; US
PAULEY JR., Robert S.; US
Agent:
WONG, Kirk; US
REES, Karl; US
GU, Zhichong; US
NGUYEN, Michael; US
Priority Data:
15/273,38522.09.2016US
Title (EN) HIGH DENSITY MEMORY MODULE SYSTEM
(FR) SYSTÈME DE MODULE DE MÉMOIRE À HAUTE DENSITÉ
Abstract:
(EN) Approaches, techniques, and mechanisms are disclosed for manufacturing and operating high density memory systems. The high density memory systems can increase the amount of memory available to a computing system by allowing the connection of multiple memory modules into a single memory interface on a motherboard via a memory adapter as described herein.
(FR) L'invention concerne des approches, des techniques et des mécanismes de fabrication et de fonctionnement de systèmes de mémoire à haute densité. Les systèmes de mémoire à haute densité peuvent augmenter la quantité de mémoire disponible pour un système informatique en permettant la liaison de multiples modules de mémoire dans une seule interface de mémoire sur une carte mère par l'intermédiaire d'un adaptateur de mémoire tel que décrit ici.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)