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1. (WO2018057026) DIE WITH EMBEDDED COMMUNICATION CAVITY

Pub. No.:    WO/2018/057026    International Application No.:    PCT/US2016/053681
Publication Date: Fri Mar 30 01:59:59 CEST 2018 International Filing Date: Tue Sep 27 01:59:59 CEST 2016
IPC: H01L 25/065
H01L 25/10
H01L 23/66
H01L 23/538
H01L 23/552
H01L 23/00
Applicants: INTEL CORPORATION
Inventors: NAIR, Vijay K.
RAORANE, Digvijay
Title: DIE WITH EMBEDDED COMMUNICATION CAVITY
Abstract:
Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed in the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.