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Machine translation
1. (WO2018057007) DIE WITH EMBEDDED COMMUNICATION CAVITY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/057007    International Application No.:    PCT/US2016/053503
Publication Date: 29.03.2018 International Filing Date: 23.09.2016
IPC:
H01L 25/065 (2006.01), H01L 23/522 (2006.01), H01L 23/538 (2006.01), H01L 23/66 (2006.01), H01L 23/00 (2006.01)
Applicants: NAIR, Vijay K. [US/US]; (US).
RAORANE, Digvijay [US/US]; (US)
Inventors: NAIR, Vijay K.; (US).
RAORANE, Digvijay; (US)
Agent: PERDOK, Monique M.; (US).
BLACK, David W., Reg. No. 42,331; (US).
ARORA, Suneel, Reg. No. 42,267; (US).
BEEKMAN, Marvin L., Reg. No. 38,377; (US).
BIANCHI, Timothy E., Reg. No. 39,610; (US).
WOO, Justin N., Reg. No. 62,686; (US).
GOULD, James R., Reg. No. 72,086; (US).
SCHEER, Bradley W., Reg. No. 47,059; (US).
MCCRACKIN, Ann M., Reg. No. 42,858; (US)
Priority Data:
Title (EN) DIE WITH EMBEDDED COMMUNICATION CAVITY
(FR) PUCE À CAVITÉ DE COMMUNICATION INTÉGRÉE
Abstract: front page image
(EN)Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include a substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed on the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.
(FR)D'une manière générale, l'invention concerne des systèmes, des dispositifs et des procédés qui comprennent une cavité de communication. Selon un exemple, un dispositif peut comprendre un substrat comportant une première cavité formée en son sein, des première et seconde antennes exposées dans la cavité et entourées par cette dernière, et une structure d'interconnexion formée sur le substrat, la structure d'interconnexion comprenant des couches de matériau conducteur alternées et des couches diélectriques entre couches.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)