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1. (WO2018056594) FLEXIBLE CIRCUIT BOARD HAVING VIA PAD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/056594 International Application No.: PCT/KR2017/009252
Publication Date: 29.03.2018 International Filing Date: 24.08.2017
IPC:
H05K 1/11 (2006.01) ,H05K 1/03 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants: STEMCO CO., LTD.[KR/KR]; 79-44, Gwahaksaneop 4-ro, Oksan-myeon, Heungdeokgu, Cheongju-si, Chungcheongbuk-do 28122, KR
Inventors: LEE, Jin Han; KR
Agent: KASAN IP & LAW FIRM; 7th Floor, Hanwon Building 2423 Nambusunhwan-ro, Seocho-gu, Seoul 06719, KR
Priority Data:
10-2016-012240323.09.2016KR
Title (EN) FLEXIBLE CIRCUIT BOARD HAVING VIA PAD
(FR) CARTE DE CIRCUIT IMPRIMÉ SOUPLE AYANT UNE PASTILLE DE TROU D'INTERCONNEXION
(KO) 비아 패드를 갖는 연성 회로 기판
Abstract:
(EN) Provided is a flexible circuit board. The flexible circuit board comprises: a base film; a first wiring pattern extending in a first direction on one surface of the base film; a via pad connected to the first wiring pattern in a connection region and having a polygonal shape; and a via hole penetrating the base film and overlapping with the via pad, wherein the via pad comprises a width in a second direction perpendicular to the first direction, and the width in the second direction decreases as the via pad is closer to the first direction in the connection region.
(FR) L'invention concerne une carte de circuit imprimé souple. La carte de circuit imprimé souple comprend : un film de base ; un premier motif de câblage s'étendant dans une première direction sur une surface du film de base ; une pastille de trou d'interconnexion connectée au premier motif de câblage dans une région de connexion et ayant une forme polygonale ; et un trou d'interconnexion pénétrant dans le film de base et chevauchant la pastille de trou d'interconnexion, la pastille de trou d'interconnexion comprenant une largeur dans une seconde direction perpendiculaire à la première direction, et la largeur dans la seconde direction diminuant à mesure que la pastille de trou d'interconnexion se rapproche de la première direction dans la région de connexion.
(KO) 연성 회로 기판이 제공된다. 연성 회로 기판은, 베이스 필름, 상기 베이스 필름의 일면 상에서 제1 방향으로 연장되는 제1 배선 패턴, 상기 제1 배선 패턴과 연결 영역에서 연결되고, 다각형 형상을 갖는 비아 패드, 및 상기 베이스 필름을 관통하고, 상기 비아 패드와 중첩되는 비아홀을 포함하되, 상기 비아 패드는, 상기 제1 방향과 수직인 제2 방향의 폭을 포함하되, 상기 연결 영역에서 상기 제1 방향으로 갈수록 상기 제2 방향의 폭이 감소한다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)