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|1. (WO2018056314) MULTILAYER METAL BALL|
|Applicants:||NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
NIPPON MICROMETAL CORPORATION
|Title:||MULTILAYER METAL BALL|
Provided is a multilayer metal ball having a superior spacer function and high bond reliability. With this multilayer metal ball 1, deformation thereof when the multilayer metal ball 1 has been mounted to an electronic component can be suppressed, and to that extent, a multilayer metal ball 1 having a superior spacer function in a three-dimensional mounting such as a layered structure or an MCM can be achieved. Additionally, a multilayer metal ball with good sphericity can be achieved with this multilayer metal ball 1, and thus, to that extent, stability in array positioning during bonding is increased and bonding defects can be suppressed, and an effect of isotropically dispersing thermal warping during bonding can be increased. Thus, superior bond reliability in a post-mounting thermal cycling evaluation can be had with this multilayer metal ball 1. Consequently, a multilayer metal ball having a superior spacer function and high bond reliability is provided.