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1. (WO2018056314) MULTILAYER METAL BALL

Pub. No.:    WO/2018/056314    International Application No.:    PCT/JP2017/033932
Publication Date: Fri Mar 30 01:59:59 CEST 2018 International Filing Date: Thu Sep 21 01:59:59 CEST 2017
IPC: B23K 35/14
B22F 1/02
B23K 35/26
C22C 13/00
C22C 13/02
C22C 19/03
Applicants: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
日鉄ケミカル&マテリアル株式会社
NIPPON MICROMETAL CORPORATION
日鉄マイクロメタル株式会社
Inventors: UNO Tomohiro
宇野 智裕
HASHINO Eiji
橋野 英児
AKASHI Keisuke
赤司 圭介
KIMURA Katsuichi
木村 勝一
Title: MULTILAYER METAL BALL
Abstract:
Provided is a multilayer metal ball having a superior spacer function and high bond reliability. With this multilayer metal ball 1, deformation thereof when the multilayer metal ball 1 has been mounted to an electronic component can be suppressed, and to that extent, a multilayer metal ball 1 having a superior spacer function in a three-dimensional mounting such as a layered structure or an MCM can be achieved. Additionally, a multilayer metal ball with good sphericity can be achieved with this multilayer metal ball 1, and thus, to that extent, stability in array positioning during bonding is increased and bonding defects can be suppressed, and an effect of isotropically dispersing thermal warping during bonding can be increased. Thus, superior bond reliability in a post-mounting thermal cycling evaluation can be had with this multilayer metal ball 1. Consequently, a multilayer metal ball having a superior spacer function and high bond reliability is provided.