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1. WO2018056069 - CAMERA MODULE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE

Publication Number WO/2018/056069
Publication Date 29.03.2018
International Application No. PCT/JP2017/032392
International Filing Date 08.09.2017
IPC
G03B 17/02 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
02Bodies
G02B 7/02 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
02for lenses
H04N 5/225 2006.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment
225Television cameras
CPC
G02B 7/02
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
02for lenses
G03B 17/02
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
02Bodies
G03B 17/55
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
55with provision for heating or cooling, e.g. in aircraft
G03B 30/00
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
30Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
H04N 5/225
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
H04N 5/2253
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
2253Mounting of pick-up device, electronic image sensor, deviation or focusing coils
Applicants
  • ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP]/[JP]
Inventors
  • 籾内 雄太 MOMIUCHI Yuta
  • 高岡 裕二 TAKAOKA Yuji
  • 中山 浩和 NAKAYAMA Hirokazu
  • 田仲 清久 TANAKA Kiyohisa
  • 戸川 実栄 TOGAWA Miyoshi
  • 関 大一 SEKI Hirokazu
Agents
  • 西川 孝 NISHIKAWA Takashi
  • 稲本 義雄 INAMOTO Yoshio
Priority Data
2016-18534723.09.2016JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) CAMERA MODULE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
(FR) MODULE DE CAMÉRA, PROCÉDÉ DE FABRICATION ET DISPOSITIF ÉLECTRONIQUE
(JA) カメラモジュール、製造方法、及び、電子機器
Abstract
(EN) The present technology relates to a camera module, a manufacturing method, and an electronic device with which reductions in positional accuracy and heat radiation performance of an optical module can be suppressed. An imaging element is joined to one surface of a flexible substrate so that a light-receiving surface of the imaging element is exposed from an opening of the flexible substrate. An optical module is joined to the other surface of the flexible substrate so as to cause light to be incident on the imaging element, via the opening. A reinforcing member is joined to the periphery of the imaging element on the one surface of the flexible substrate, and reinforces a joint portion of the flexible substrate at which the optical module is joined. The reinforcing member is joined so as to oppose a range including at least part of the joint portion, and is configured so that part of the periphery of the imaging element is open. The present technology can be applied to, for example, a camera module in which an imaging element and an optical module are integrated.
(FR) La présente invention concerne un module de caméra, un procédé de fabrication et un dispositif électronique avec lesquels des réductions de précision de position et de performance de rayonnement thermique d'un module optique peuvent être supprimées. Un élément d'imagerie est joint à une surface d'un substrat souple de telle sorte qu'une surface de réception de lumière de l'élément d'imagerie soit exposée à partir d'une ouverture du substrat souple. Un module optique est joint à l'autre surface du substrat souple de façon à amener la lumière à être incidente sur l'élément d'imagerie, par l'intermédiaire de l'ouverture. Un élément de renforcement est joint à la périphérie de l'élément d'imagerie sur la surface du substrat souple, et renforce une partie de joint du substrat souple au niveau de laquelle le module optique est joint. L'élément de renforcement est joint de manière à s'opposer à une plage comprenant au moins une partie de la partie de joint, et est configuré de telle sorte qu'une partie de la périphérie de l'élément d'imagerie est ouverte. La présente technologie peut être appliquée, par exemple, à un module de caméra dans lequel un élément d'imagerie et un module optique sont intégrés.
(JA) 本技術は、光学モジュールの位置の精度や放熱性の低下を抑制することができるようにするカメラモジュール、製造方法、及び、電子機器に関する。 撮像素子は、その撮像素子の受光面が、フレキシブル基板の開口部から露出するように、フレキシブル基板の一方の面に接合され、光学モジュールは、開口部を介して、撮像素子に光を入射させるように、フレキシブル基板の他方の面に接合されている。補強部材は、フレキシブル基板の一方の面の、撮像素子の周囲に接合されており、光学モジュールが接合されるフレキシブル基板の接合部分を補強する。補強部材は、接合部分の少なくとも一部を含む範囲に対向するように接合され、撮像素子の周囲の一部が開口するように構成される。本技術は、例えば、撮像素子と光学モジュールとが一体になったカメラモジュールに適用することができる。
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