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1. (WO2018055926) DEVICE TEMPERATURE ADJUSTING APPARATUS

Pub. No.:    WO/2018/055926    International Application No.:    PCT/JP2017/028284
Publication Date: Fri Mar 30 01:59:59 CEST 2018 International Filing Date: Fri Aug 04 01:59:59 CEST 2017
IPC: F28D 15/02
F28D 15/06
H01M 10/613
H01M 10/625
H01M 10/633
H01M 10/6556
H01M 10/6569
H05K 7/20
Applicants: DENSO CORPORATION
株式会社デンソー
Inventors: TAKEUCHI Masayuki
竹内 雅之
MIURA Koji
三浦 功嗣
OMI Yasumitsu
大見 康光
YOSHINORI Takeshi
義則 毅
YAMANAKA Takashi
山中 隆
KATO Yoshiki
加藤 吉毅
Title: DEVICE TEMPERATURE ADJUSTING APPARATUS
Abstract:
A device temperature adjusting apparatus (1) is provided with: a heat absorption section (12) which absorbs heat from a device (BP) subject to temperature adjustment so as to vaporize a liquid phase working fluid; and a heat dissipation section (14) which is arranged further upward than the heat absorption section, and which dissipates heat from a gas phase working fluid so as to condense the same. The device temperature adjusting apparatus is also provided with: an outward path section (18) having formed therein an outward flow channel (182) for guiding working fluid from the heat dissipation section to the heat absorption section; and a return path section (16) having formed therein a return flow channel (162) for guiding working fluid from the heat absorption section to the heat dissipation section. The device temperature adjusting apparatus is further provided with a circulation promotion section (20) for promoting circulation of the working fluid in an annular fluid circulation circuit (10) configured including the heat absorption section, the heat dissipation section, the outward path section, and the return path section. The circulation promotion section is configured so as to cool working fluid flowing through the outward flow channel and/or heat working fluid flowing through the return flow channel.