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1. (WO2018055848) ELECTRICALLY CONDUCTIVE PASTE, AND WIRING BOARD USING SAME
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Pub. No.: WO/2018/055848 International Application No.: PCT/JP2017/021608
Publication Date: 29.03.2018 International Filing Date: 12.06.2017
IPC:
H01B 1/22 (2006.01) ,C09C 1/62 (2006.01) ,C09C 3/08 (2006.01) ,C09D 5/24 (2006.01) ,C09D 7/12 (2006.01) ,C09D 201/00 (2006.01) ,H01B 1/00 (2006.01) ,H05K 1/09 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
C
TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES; PREPARATION OF CARBON BLACK
1
Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
62
Metallic pigments or fillers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
C
TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES; PREPARATION OF CARBON BLACK
3
Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
08
Treatment with low-molecular-weight organic compounds
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
5
Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
24
Electrically-conducting paints
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7
Features of coating compositions, not provided for in group C09D5/88
12
Other additives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
201
Coating compositions based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
Applicants:
矢崎総業株式会社 YAZAKI CORPORATION [JP/JP]; 東京都港区三田一丁目4番28号 4-28, Mita 1-chome, Minato-ku, Tokyo 1088333, JP
Inventors:
山田 牧 YAMADA Maki; JP
勝又 梨江 KATSUMATA Rie; JP
青山 征人 AOYAMA Yukito; JP
Agent:
三好 秀和 MIYOSHI Hidekazu; JP
高橋 俊一 TAKAHASHI Shunichi; JP
伊藤 正和 ITO Masakazu; JP
高松 俊雄 TAKAMATSU Toshio; JP
Priority Data:
2016-18424221.09.2016JP
Title (EN) ELECTRICALLY CONDUCTIVE PASTE, AND WIRING BOARD USING SAME
(FR) PÂTE ÉLECTRIQUEMENT CONDUCTRICE ET TABLEAU DE CONNEXIONS L'UTILISANT
(JA) 導電性ペースト及びそれを用いた配線板
Abstract:
(EN) An electrically conductive paste contains: metal nanoparticles having a mean particle diameter of 30-400 nm, protected by an organic compound containing an amino group; metal particles having a mean particle diameter of 1-5 µm, protected by a higher fatty acid; an organic solvent; and a resin component. Also, a conductor made by calcination of the electrically conductive paste has a film thickness of 30 µm or greater, and has specific resistance of 5.0 x 10–6Ω•cm or less. In this way, with the electrically conductive paste, it is possible to lower the resistance of the obtained conductor, and to increase the amount of current that flows. A wiring board is provided with the conductor obtained from the electrically conductive paste.
(FR) L'invention concerne une pâte électriquement conductrice contenant : des nanoparticules métalliques présentant un diamètre moyen de particule de 30 à 400 nm, protégées par un composé organique contenant un groupe amino ; des particules métalliques présentant un diamètre moyen de particule de 1 à 5 µm, protégées par un acide gras supérieur ; un solvant organique ; et un composant de résine. En outre, un conducteur réalisé par calcination de la pâte électriquement conductrice présente une épaisseur de film de 30 µm ou plus, et présente une résistance spécifique de 5,0 x 10–6Ω•cm ou moins. Ainsi, avec la pâte électriquement conductrice, il est possible de réduire la résistance du conducteur obtenu, et d'augmenter la quantité de courant qui circule. Un tableau de connexions est pourvu du conducteur obtenu à partir de la pâte électriquement conductrice.
(JA) 導電性ペーストは、アミノ基を含有する有機化合物で保護され、平均粒子径が30nm~400nmである金属ナノ粒子と、高級脂肪酸で保護され、平均粒子径が1μm~5μmである金属粒子と、有機溶剤と、樹脂成分とを含有する。そして、導電性ペーストを焼成してなる導体は、膜厚が30μm以上であり、かつ、比抵抗が5.0×10-6Ω・cm以下である。このように、導電性ペーストは、得られる導体を低抵抗化し、流れる電流量を高めることが可能となる。配線板は、当該導電性ペーストより得られる導体を備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)