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1. (WO2018055663) IMAGING DEVICE AND MOUNTING DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2018/055663 International Application No.: PCT/JP2016/077647
Publication Date: 29.03.2018 International Filing Date: 20.09.2016
IPC:
H05K 13/08 (2006.01) ,G06T 1/00 (2006.01) ,H05K 13/04 (2006.01) ,G01N 21/956 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08
Monitoring manufacture of assemblages
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
T
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
1
General purpose image data processing
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04
Mounting of components
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21
Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible, or ultra-violet light
84
Systems specially adapted for particular applications
88
Investigating the presence of flaws, defects or contamination
95
characterised by the material or shape of the object to be examined
956
Inspecting patterns on the surface of objects
Applicants:
株式会社FUJI FUJI CORPORATION [JP/JP]; 愛知県知立市山町茶碓山19番地 19, Chausuyama, Yamamachi, Chiryu-shi, Aichi 4728686, JP
Inventors:
大木 秀晃 OKI, Hideaki; JP
大崎 聡士 OSAKI, Satoshi; JP
深谷 芳行 FUKAYA, Yoshiyuki; JP
Agent:
特許業務法人アイテック国際特許事務所 ITEC INTERNATIONAL PATENT FIRM; 愛知県名古屋市中区錦二丁目16番26号SC伏見ビル SC Fushimi Bldg., 16-26, Nishiki 2-chome, Naka-ku, Nagoya-shi, Aichi 4600003, JP
Priority Data:
Title (EN) IMAGING DEVICE AND MOUNTING DEVICE
(FR) DISPOSITIF D'IMAGERIE ET DISPOSITIF DE MONTAGE
(JA) 撮像装置及び実装装置
Abstract:
(EN) An imaging control unit 52 of a parts camera 40 of the present invention causes a light source 44 for vertical illumination and a light source 47 for side illumination to emit light when imaging a component 90 such that the amount of light received from vertical illumination is less than the amount of light received from side illumination when imaging the component 90 having wiring patterns 95, 96 and terminals 93, 94 having flat surfaces. The amount of light received from vertical illumination is the amount of light emitted from the light source 44 for vertical illumination, reflected by the component 90, and received by an imaging unit 51. Similarly, the amount of light received from side illumination is the amount of light emitted from the light source 47 for side illumination, reflected by the component 90, and received by the imaging unit 51.
(FR) Une unité de commande d'imagerie 52 d'une caméra de parties 40 de la présente invention amène une source de lumière 44 pour un éclairage vertical et une source de lumière 47 pour un éclairage latéral à émettre de la lumière lors de l'imagerie d'un composant 90 de telle sorte que la quantité de lumière reçue à partir d'un éclairage vertical est inférieure à la quantité de lumière reçue à partir d'un éclairage latéral lors de l'imagerie du composant 90 ayant des motifs de câblage 95, 96 et des bornes 93, 94 ayant des surfaces plates. La quantité de lumière reçue à partir de l'éclairage vertical est la quantité de lumière émise par la source de lumière 44 pour un éclairage vertical, réfléchie par le composant 90, et reçue par une unité d'imagerie 51. De même, la quantité de lumière reçue à partir de l'éclairage latéral est la quantité de lumière émise par la source de lumière 47 pour un éclairage latéral, réfléchie par le composant 90, et reçue par l'unité d'imagerie 51.
(JA) パーツカメラ40の撮像制御部52は、配線パターン95,96と表面が平坦な端子93,94とを有する部品90を撮像するにあたり、落射受光量が側射受光量よりも小さくなるように、部品90の撮像時に落射用光源44及び側射用光源47を発光させる。落射受光量とは、落射用光源44から発せられ部品90で反射して撮像部51に受光される光の光量である。同様に、側射受光量とは、側射用光源47から発せられ部品90で反射して撮像部51に受光される光の光量である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)