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Machine translation
1. (WO2018053005) HEATSINK INCLUDING THICK FILM LAYER FOR UV LED ARRAYS, AND METHODS OF FORMING UV LED ARRAYS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/053005    International Application No.:    PCT/US2017/051370
Publication Date: 22.03.2018 International Filing Date: 13.09.2017
IPC:
H01L 33/44 (2010.01), H01L 25/075 (2006.01), H01L 33/62 (2010.01), H01L 33/64 (2010.01), H01L 33/48 (2010.01)
Applicants: HERAEUS NOBLELIGHT AMERICA LLC [US/US]; 910 Clopper Road Gaithersburg, MD 20878 (US)
Inventors: JOHNSON, William, E. III; (US).
LEONHARDT, Darrin; (US).
GHARAGOZLOO, Mahmood; (US)
Agent: SPLETZER, Christopher, M.; (US).
CASEY, Kevin, R.; (US).
O'DONOGHUE, Elizabeth, M.; (US).
FORET, Philip, J.; (US).
FITZGIBBON, David, P.; (US)
Priority Data:
62/395,690 16.09.2016 US
Title (EN) HEATSINK INCLUDING THICK FILM LAYER FOR UV LED ARRAYS, AND METHODS OF FORMING UV LED ARRAYS
(FR) DISSIPATEUR THERMIQUE COMPRENANT UNE COUCHE DE FILM ÉPAIS POUR RÉSEAUX DE LED UV, ET PROCÉDÉS DE FORMATION DE RÉSEAUX DE LED UV
Abstract: front page image
(EN)An ultraviolet LED array is provided. The ultraviolet LED array includes a heatsink. The heatsink includes (i) a base heatsink element, and (ii) a thick film layer applied to the base heatsink element. The ultraviolet LED array also includes a plurality of ultraviolet LED elements coupled directly to the thick film layer of the heatsink.
(FR)L'invention concerne un réseau de LED ultraviolettes. Le réseau de LED ultraviolettes comprend un dissipateur thermique. Le dissipateur thermique comprend (i) un élément de dissipateur thermique de base, et (ii) une couche de film épais appliquée à l'élément de dissipateur thermique de base. Le réseau de LED ultraviolettes comprend également une pluralité d'éléments de LED ultraviolettes couplés directement à la couche de film épais du dissipateur thermique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)