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1. (WO2018052816) CHEMICAL MECHANICAL POLISHING SMART RING

Pub. No.:    WO/2018/052816    International Application No.:    PCT/US2017/050822
Publication Date: Fri Mar 23 00:59:59 CET 2018 International Filing Date: Sat Sep 09 01:59:59 CEST 2017
IPC: B24B 37/32
B24B 37/005
B24B 49/00
B24B 57/02
H01L 21/306
Applicants: APPLIED MATERIALS, INC.
Inventors: HUANG, Zubin
WELLS, Stephen A.
GOPALAN, Ramesh
SHEELAVANT, Gangadhar
YAVELBERG, Simon
Title: CHEMICAL MECHANICAL POLISHING SMART RING
Abstract:
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, and a sensor assembly. The retaining ring is coupled to the body. The sensor assembly is positioned at least partially in the body. The sensor assembly includes a transmitter, an antenna, and a vibrational sensor. The transmitter has a first end and a second end. The antenna is coupled to the first end of the transmitter. The vibrational sensor is coupled to the second end. The vibrational sensor is configured to detect vibration during chemical mechanical processes with respect to radial, azimuthal, and angular axes of the carrier head.