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1. (WO2018052620) VISIBLE LASER CIRCUIT FAULT ISOLATION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/052620    International Application No.:    PCT/US2017/047013
Publication Date: 22.03.2018 International Filing Date: 15.08.2017
IPC:
G01R 31/311 (2006.01)
Applicants: QUALCOMM INCORPORATED [US/US]; ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 (US)
Inventors: GORUGANTHU, Rama Rao; (US).
MATTEY, Gaurav Sunil; (US).
VILLAFANA, Martin; (US)
Agent: HALLMAN, Jonathan W.; (US)
Priority Data:
15/268,463 16.09.2016 US
Title (EN) VISIBLE LASER CIRCUIT FAULT ISOLATION
(FR) ISOLATION DE DÉFAUT DE CIRCUIT LASER VISIBLE
Abstract: front page image
(EN)A transparent coversheet intervenes between a lens and a thinned die in a visible light fault analysis tool so that the thinned die is robust to fractures. In addition, the transparent coversheet has a greater thermal mass than the thinned die and thus acts as a heat sink to prevent active circuitry in the thinned die from overheating during the visible light fault analysis.
(FR)La présente invention concerne une feuille de couverture transparente qui intervient entre une lentille et une puce amincie dans un outil d'analyse de défaut de lumière visible pour que la puce amincie soit résistante aux fractures. En outre, la feuille de couverture transparente possède une masse thermique supérieure à celle de la puce amincie et sert ainsi de dissipateur thermique pour empêcher des circuits actifs dans la puce amincie de surchauffer pendant l'analyse de défaut de lumière visible.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)