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Machine translation
1. (WO2018052460) BODY TIE OPTIMIZATION FOR STACKED TRANSISTOR AMPLIFIER
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/052460    International Application No.:    PCT/US2016/057052
Publication Date: 22.03.2018 International Filing Date: 14.10.2016
Chapter 2 Demand Filed:    20.12.2017    
IPC:
H03F 3/195 (2006.01), H03F 3/21 (2006.01), H03F 1/52 (2006.01), H03F 1/22 (2006.01)
Applicants: PEREGRINE SEMICONDUCTOR CORPORATION [US/US]; 9380 Carroll Park Drive San Diego, CA 92121 (US)
Inventors: WILLARD, Simon, Edward; (US).
OLSON, Chris; (US).
RANTA, Tero, Tapio; (US)
Agent: STEINFL, Alessandro; (US).
BRUNO, Enrica; (US).
CASH, Brian; (US).
PEREZ, Ronald; (US).
DONG, Lun-Cong; (US).
XU, Jiancong; (US).
PIZZOLI, Antonio; c/o Società Italiana Brevetti S.p.a Via Carducci 8 20123 Milano (IT)
Priority Data:
15/268,257 16.09.2016 US
Title (EN) BODY TIE OPTIMIZATION FOR STACKED TRANSISTOR AMPLIFIER
(FR) OPTIMISATION DE LIAISON AU CORPS DESTINÉE À UN AMPLIFICATEUR À TRANSISTORS EMPILÉS
Abstract: front page image
(EN)A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.
(FR)L'invention porte sur un empilement de transistors qui peut comprendre une combinaison de dispositifs flottants et liés au corps. L'utilisation d'un seul dispositif lié au corps en guise de transistor d'entrée ou de sortie de l'empilement, les autres transistors de l'empilement étant des transistors flottants, peut permettre d'obtenir un rendement amélioré de l'amplificateur RF. L'utilisation de tous les dispositifs liés au corps de l'empilement peut permettre d'améliorer la réponse transitoire de l'amplificateur RF.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)