Search International and National Patent Collections

1. (WO2018051973) SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT

Pub. No.:    WO/2018/051973    International Application No.:    PCT/JP2017/032834
Publication Date: Fri Mar 23 00:59:59 CET 2018 International Filing Date: Wed Sep 13 01:59:59 CEST 2017
IPC: B23K 35/26
C22C 13/00
C22C 13/02
H05K 3/34
Applicants: SENJU METAL INDUSTRY CO., LTD.
千住金属工業株式会社
Inventors: TACHIBANA Ken
立花 賢
NOMURA Hikaru
野村 光
IIJIMA Yuki
飯島 裕貴
YOSHIKAWA Shunsaku
吉川 俊策
IZUMITA Naoko
泉田 尚子
SAITO Takashi
齋藤 岳
YOKOYAMA Takahiro
横山 貴大
Title: SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT
Abstract:
Provided is a solder alloy that has excellent wettability for preventing soldering defects, enables high bond strength in solder joints after soldering, suppresses breakage at bond interfaces, and also suppresses EM generation. In order to ensure reliability when bonding and long-term reliability after bonding, the present invention has an alloy composition comprising, in mass%, 0.1% to less than 2.0% of Bi, 0.1-1.0% of Cu, 0.01-0.20% of Ni, 0.006-0.09% of Ge, and 0.003% to less than 0.05% of Co, with the remainder comprising Sn.