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1. (WO2018051715) FLAME-RETARDANT RESIN COMPOSITION AND RESIN-COATED COPPER FOIL
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Pub. No.: WO/2018/051715 International Application No.: PCT/JP2017/029544
Publication Date: 22.03.2018 International Filing Date: 17.08.2017
IPC:
C08L 35/00 (2006.01) ,B32B 15/08 (2006.01) ,C08K 5/52 (2006.01) ,C08K 5/5399 (2006.01) ,C08L 27/12 (2006.01) ,C08L 63/00 (2006.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
35
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
49
Phosphorus-containing compounds
51
Phosphorus bound to oxygen
52
bound to oxygen only
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
49
Phosphorus-containing compounds
5399
Phosphorus bound to nitrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
27
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
02
not modified by chemical after-treatment
12
containing fluorine atoms
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
タツタ電線株式会社 TATSUTA ELECTRIC WIRE & CABLE CO., LTD. [JP/JP]; 大阪府東大阪市岩田町2丁目3番1号 3-1, Iwata-cho 2-chome, Higashiosaka-shi, Osaka 5788585, JP
Inventors:
梅田 裕明 UMEDA, Hiroaki; JP
宮本 真憲 MIYAMOTO, Masanori; JP
松田 和大 MATSUDA, Kazuhiro; JP
湯川 健 YUKAWA, Ken; JP
Agent:
蔦田 正人 TSUTADA, Masato; JP
中村 哲士 NAKAMURA, Satoshi; JP
富田 克幸 TOMITA, Katsuyuki; JP
有近 康臣 ARICHIKA, Yasuomi; JP
前澤 龍 MAEZAWA, Ryo; JP
水鳥 正裕 MIZUTORI, Masahiro; JP
蔦田 璋子 TSUTADA, Akiko; JP
Priority Data:
2016-17961114.09.2016JP
Title (EN) FLAME-RETARDANT RESIN COMPOSITION AND RESIN-COATED COPPER FOIL
(FR) COMPOSITION DE RÉSINE IGNIFUGE ET FEUILLE DE CUIVRE REVÊTUE DE RÉSINE
(JA) 難燃性樹脂組成物及び樹脂付き銅箔
Abstract:
(EN) Provided are: a flame-retardant resin composition which gives a flame-retardant resin having a satisfactory balance among all of adhesion, flame retardancy, permittivity, and dielectric dissipation factor; the flame-retardant resin; and a resin-coated copper foil, copper-clad laminate, and printed wiring board each including the flame-retardant resin. The flame-retardant resin composition comprises a resinous component comprising a bismaleimide compound represented by general formula (I), a hardener, a phosphorus-compound flame retardant, e.g., a cyclophosphazene represented by general formula (II), and a fluororesin filler, the content of the hardener being 0.5-30 parts by mass per 100 parts by mass of the resinous component, the content of the phosphorus-compound flame retardant being 5-30 parts by mass per 100 parts by mass of the resinous component, and the content of the fluororesin filler being 10-200 parts by mass per 100 parts by mass of the resinous component.
(FR) L'invention concerne : une composition de résine ignifuge qui donne une résine ignifuge présentant un équilibre satisfaisant entre adhérence, ininflammabilité, constante diélectrique et facteur de dissipation diélectrique ; la résine ignifuge ; et une feuille de cuivre revêtue de résine, un stratifié cuivré et une carte de circuit imprimé comprenant chacun la résine ignifuge. La composition de résine ignifuge comprend un composant résineux comprenant un composé de bismaléimide représenté par la formule générale (I), un durcisseur, un retardateur de flamme composé de phosphore, par exemple un cyclophosphazène représenté par la formule générale (II), et une charge de résine fluorée, la teneur en durcisseur variant de 0,5 à 30 parties en poids pour 100 parties en poids du composant résineux, la teneur en retardateur de flamme composé de phosphore variant de 5 à 30 parties en poids pour 100 parties en poids du composant résineux, et la teneur en charge de résine fluorée variant de 10 à 200 parties en poids pour 100 parties en poids du composant résineux.
(JA) 密着性、難燃性、誘電率及び誘電正接の全てをバランス良く兼ね備えた難燃性樹脂が得られる難燃性樹脂組成物及びその難燃性樹脂、並びにこれを用いた樹脂付き銅箔、銅張積層板、及びプリント配線板を提供する。 下記一般式(I)で表されるビスマレイミド化合物を含有する樹脂成分、硬化剤、下記一般式(II)で表されるシクロホスファゼン等のリン系難燃剤、及びフッ素樹脂フィラーを含有し、硬化剤の含有量が、樹脂成分100質量部に対して0.5~30質量部であり、リン系難燃剤の含有量が、樹脂成分100質量部に対して5~30質量部であり、フッ素樹脂フィラーの含有量が、樹脂成分100質量部に対して10~200質量部である難燃性樹脂組成物とする。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)