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1. (WO2018051475) SOLDER JOINING METHOD AND SOLDER JOINING DEVICE

Pub. No.:    WO/2018/051475    International Application No.:    PCT/JP2016/077370
Publication Date: Fri Mar 23 00:59:59 CET 2018 International Filing Date: Sat Sep 17 01:59:59 CEST 2016
IPC: B23K 1/002
H05K 3/34
Applicants: WONDER FUTURE CORPORATION
株式会社ワンダーフューチャーコーポレーション
Inventors: SUGIYAMA Kazuhiro
杉山 和弘
SATO Akira
佐藤 彰
FUKUDA Koki
福田 光樹
Title: SOLDER JOINING METHOD AND SOLDER JOINING DEVICE
Abstract:
Provided is a solder joining technique whereby joining time is reduced and joining precision can easily be ensured. In electromagnetic induction heating in the present invention, only a metal heats when an alternating electric current is passed through a coil conductor. Since the output of a power source can easily be controlled, step control and other complex control can easily be performed with good precision in the present invention. For example, for a solder paste including a thermosetting resin and solder particles, heating control is performed so that the thermosetting resin is softened before the solder particles melt, and for a solder paste including solder particles, a solvent, and a flux, heating control is performed so that the solvent is evaporated and the flux is liquefied before the solder particles melt.