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1. (WO2018051430) SEMICONDUCTOR LASER MODULE AND ADDITIVE MANUFACTURING DEVICE
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Pub. No.: WO/2018/051430 International Application No.: PCT/JP2016/077102
Publication Date: 22.03.2018 International Filing Date: 14.09.2016
IPC:
G02B 6/42 (2006.01) ,H01S 5/022 (2006.01) ,H01S 5/024 (2006.01)
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24
Coupling light guides
42
Coupling light guides with opto-electronic elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
024
Cooling arrangements
Applicants:
技術研究組合次世代3D積層造形技術総合開発機構 TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING [JP/JP]; 東京都中央区日本橋1丁目2番19号 日本橋ファーストビル6階 6F Nihonbashi First Bldg., 2-19, Nihonbashi 1-chome, Chuo-ku, Tokyo 1030027, JP
Inventors:
石毛 悠太 ISHIGE Yuta; JP
片山 悦治 KATAYAMA Etsuji; JP
森 肇 MORI Hajime; JP
Agent:
加藤 卓士 KATO Takashi; JP
奥住 忍 OKUZUMI Shinobu; JP
Priority Data:
Title (EN) SEMICONDUCTOR LASER MODULE AND ADDITIVE MANUFACTURING DEVICE
(FR) MODULE LASER À SEMI-CONDUCTEUR ET DISPOSITIF DE FABRICATION ADDITIVE
(JA) 半導体レーザモジュールおよび3次元積層造形装置
Abstract:
(EN) The present invention minimizes variations in the coupling efficiency of the light output from a laser element to an optical fiber. A semiconductor laser module comprises a plurality of semiconductor laser elements, an optical fiber, a light collection means for collecting the laser light emitted from the semiconductor laser elements into the optical fiber, and a housing having the laser elements, the light collection means, and the optical fiber mounted therein, the semiconductor laser module including at least one thin plate disposed between the laser elements and the top plate of the housing and mounted on the top plate to form a gap with the top plate.
(FR) La présente invention réduit au minimum les variations de l'efficacité de couplage de la sortie de lumière d'un élément laser à une fibre optique. Un module laser à semi-conducteur comprend une pluralité d'éléments laser à semi-conducteur, une fibre optique, un moyen de collecte de lumière pour collecter la lumière laser émise à partir des éléments laser à semi-conducteur dans la fibre optique, et un boîtier ayant les éléments laser, le moyen de collecte de lumière, et la fibre optique montée à l'intérieur, le module laser à semi-conducteur comprenant au moins une plaque mince disposée entre les éléments laser et la plaque supérieure du boîtier et montée sur la plaque supérieure pour former un espace avec la plaque supérieure.
(JA) レーザ素子からの出力光の光ファイバーへの結合率の変動を抑制する。半導体レーザモジュールであって、複数の半導体レーザ素子と、光ファイバーと、半導体レーザ素子から出射されたレーザ光を前記光ファイバーへと集光する集光手段と、レーザ素子と、集光手段と、光ファイバーとが実装された筐体と、を含む半導体レーザモジュールであって、レーザ素子と、筐体の天板との間に配置され、天板との間に空隙が形成されるように天板に設置された少なくとも1つの薄板を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)