A sensor for sensing contact with an outside object is disclosed. A sensor stackup has top surface, having an outer skin adapted for contact with the outside object. The stackup also including, a deformable layer below top surface in the stackup, the deformable layer including patches made from conductive or high dielectric material. The stackup further including a capacitive sensor layer below the deformable layer, the capacitive sensor layer comprising conductors that are insulated from the patches. Each of the patches is displaceable with respect to the capacitive sensor layer in response contact with the outside object. The stackup also includes a backing layer below the capacitive sensor layer in the stackup. The sensor further includes capacitive sensor circuitry operatively connected to the capacitive sensor layer, the capacitive sensor circuitry configured to detect changes in capacitive coupling between the conductors of the capacitive sensor layer resulting from displacement of the patches with respect to the capacitive sensor layer.