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1. (WO2018048848) LOW SURFACE ROUGHNESS SUBSTRATE HAVING A VIA AND METHODS OF MAKING THE SAME

Pub. No.:    WO/2018/048848    International Application No.:    PCT/US2017/050203
Publication Date: Fri Mar 16 00:59:59 CET 2018 International Filing Date: Thu Sep 07 01:59:59 CEST 2017
IPC: C03C 15/00
C03C 23/00
B32B 7/06
B32B 17/06
B23K 26/00
B23K 26/55
H01L 23/498
H05K 3/00
H05K 3/40
Applicants: CORNING INCORPORATED
Inventors: JIN, Yuhui
Title: LOW SURFACE ROUGHNESS SUBSTRATE HAVING A VIA AND METHODS OF MAKING THE SAME
Abstract:
Methods of forming a via in substrates include etching a damage region extending through a thickness of a stack of a plurality of substrates removably bonded together. Each of the substrates in the stack has at least one surface removably bonded to a surface of another substrate in the stack, wherein when the substrates in the stack are debonded, each substrate has at least one surface that has a surface roughness (Ra) of less than or equal to about 0.6 nm.