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1. (WO2018048848) LOW SURFACE ROUGHNESS SUBSTRATE HAVING A VIA AND METHODS OF MAKING THE SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/048848    International Application No.:    PCT/US2017/050203
Publication Date: 15.03.2018 International Filing Date: 06.09.2017
IPC:
C03C 15/00 (2006.01), C03C 23/00 (2006.01), B32B 7/06 (2006.01), B32B 17/06 (2006.01), B23K 26/00 (2014.01), B23K 26/55 (2014.01), H01L 23/498 (2006.01), H05K 3/00 (2006.01), H05K 3/40 (2006.01)
Applicants: CORNING INCORPORATED [US/US]; 1 Riverfront Plaza Corning, NY 14831 (US)
Inventors: JIN, Yuhui; (US)
Agent: HARAN, John, T; (US)
Priority Data:
62/385,447 09.09.2016 US
Title (EN) LOW SURFACE ROUGHNESS SUBSTRATE HAVING A VIA AND METHODS OF MAKING THE SAME
(FR) SUBSTRAT À FAIBLE RUGOSITÉ DE SURFACE PRÉSENTANT UN TROU D'INTERCONNEXION ET PROCÉDÉS POUR SA FABRICATION
Abstract: front page image
(EN)Methods of forming a via in substrates include etching a damage region extending through a thickness of a stack of a plurality of substrates removably bonded together. Each of the substrates in the stack has at least one surface removably bonded to a surface of another substrate in the stack, wherein when the substrates in the stack are debonded, each substrate has at least one surface that has a surface roughness (Ra) of less than or equal to about 0.6 nm.
(FR)L'invention concerne des procédés de formation d'un trou d'interconnexion dans des substrats comprenant la gravure d'une zone d'endommagement s'étendant à travers une épaisseur d'une pile d'une pluralité de substrats assemblés ensemble de manière libérable. Chacun des substrats de la pile présente au moins une surface assemblée de manière libérable à une surface d'un autre substrat dans la pile, chaque substrat, lorsque les substrats dans la pile sont désassemblés, présentant au moins une surface qui présente une rugosité de surface (Ra) inférieure ou égale à environ 0,6 nm.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)