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|1. (WO2018048848) LOW SURFACE ROUGHNESS SUBSTRATE HAVING A VIA AND METHODS OF MAKING THE SAME|
|Title:||LOW SURFACE ROUGHNESS SUBSTRATE HAVING A VIA AND METHODS OF MAKING THE SAME|
Methods of forming a via in substrates include etching a damage region extending through a thickness of a stack of a plurality of substrates removably bonded together. Each of the substrates in the stack has at least one surface removably bonded to a surface of another substrate in the stack, wherein when the substrates in the stack are debonded, each substrate has at least one surface that has a surface roughness (Ra) of less than or equal to about 0.6 nm.