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1. (WO2018048482) WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE

Pub. No.:    WO/2018/048482    International Application No.:    PCT/US2017/030796
Publication Date: Fri Mar 16 00:59:59 CET 2018 International Filing Date: Thu May 04 01:59:59 CEST 2017
IPC: H01L 21/67
H01L 21/683
Applicants: RAYTHEON COMPANY
Inventors: CAHILL, Andrew
GETTY, Jonathan
LOFGREEN, Daniel, D.
DRAKE, Paul, A.
Title: WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE
Abstract:
In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second wafer on the first epoxy disposed on the first wafer and bonding the second wafer to the first epoxy under vacuum to form a two-wafer-bonded structure.