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1. (WO2018047922) OPTICAL MODULATOR MODULE

Pub. No.:    WO/2018/047922    International Application No.:    PCT/JP2017/032362
Publication Date: Fri Mar 16 00:59:59 CET 2018 International Filing Date: Fri Sep 08 01:59:59 CEST 2017
IPC: G03B 21/14
G03B 21/16
H04N 5/74
Applicants: NIPPON SEIKI CO.,LTD.
日本精機株式会社
Inventors: HADA Makoto
秦 誠
Title: OPTICAL MODULATOR MODULE
Abstract:
The present invention can favorably maintain the electrical connection of an optical modulation element. A PGA package optical modulation element 130 is attached to a socket 133 having a second contact 137. The socket 133 is surface mounted on a circuit board 180. The circuit board 180 is arranged on the back-face side of a holding plate 170. A heat dissipation unit 195 that can dissipate the heat of the optical modulation element 130 is disposed on the back-face side of the circuit board 180. A cushion part 190 having elastic and insulating properties is arranged between the circuit board 195 and the holding plate 170. The heat dissipation unit 195 and the holding plate 170 are fixed in place, and as a result, the optical modulation element 130, the socket 133, the circuit board 180, and the cushion part 190 are sandwiched within. The cushion part 190 provides a gap between the circuit board 180 and the heat dissipation unit 195 such that the second contact 137 protruding from the circuit board 180 does not contact the heat dissipation unit 195.