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1. (WO2018047823) LASER MACHINING DEVICE

Pub. No.:    WO/2018/047823    International Application No.:    PCT/JP2017/031969
Publication Date: Fri Mar 16 00:59:59 CET 2018 International Filing Date: Wed Sep 06 01:59:59 CEST 2017
IPC: B23K 26/064
B23K 26/082
G02B 26/08
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: ISHIKAWA, Kyohei
石川 恭平
NAKAMURA, Naoyuki
中村 直幸
YAMAMOTO, Tatsuya
山本 達也
SEGUCHI, Masaki
瀬口 正記
Title: LASER MACHINING DEVICE
Abstract:
A laser machining device (100) comprises: a laser oscillator (1) that emit a laser beam (L); a condensing lens (4) that irradiates a workpiece (W) with the laser beam (L); a condensing position control mechanism (2) disposed on the optical path of the laser beam (L) between the laser oscillator (1) and the condensing lens (4), the condensing position control mechanism (2) controlling the divergence angle of the laser beam (L) and the incidence width of the laser beam (L) that is incident on the condensing lens (4); a laser beam deflector (3) for deflecting the laser beam (L) before the laser beam (L) is incident on the condensing lens (4); and an emission angle control mechanism (5) for controlling the emission angle, from the condensing lens (4), of the laser beam (L) deflected by the laser beam deflector (3).