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1. (WO2018047822) CONDUCTIVE PASTE, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SOLAR CELL
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/047822 International Application No.: PCT/JP2017/031968
Publication Date: 15.03.2018 International Filing Date: 05.09.2017
IPC:
H01B 1/22 (2006.01) ,B22F 1/00 (2006.01) ,H01B 13/00 (2006.01) ,H01L 31/0224 (2006.01)
Applicants: DOWA ELECTRONICS MATERIALS CO., LTD.[JP/JP]; 14-1, Sotokanda 4-chome, Chiyoda-ku, Tokyo 1010021, JP
Inventors: HARIGAE, Kenichi; JP
KAMIGA, Hiroshi; JP
NOGAMI, Noriaki; JP
Agent: HIROTA, Koichi; JP
NAGARE, Yoshihiro; JP
MATSUDA, Naoko; JP
YAMASHITA, Takeshi; JP
Priority Data:
2016-17588408.09.2016JP
Title (EN) CONDUCTIVE PASTE, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SOLAR CELL
(FR) PÂTE CONDUCTRICE, SON PROCÉDÉ DE PRODUCTION, ET PROCÉDÉ DE PRODUCTION DE CELLULE SOLAIRE
(JA) 導電性ペーストおよびその製造方法、ならびに太陽電池の製造方法
Abstract:
(EN) Provided is a conductive paste comprising: a conductive powder containing silver; an indium powder; a silver/tellurium-coated glass powder; a solvent; and an organic binder. The silver/tellurium-coated glass powder includes a coating layer the primary components of which are silver and tellurium and which is formed on the surface of a tellurium-based glass powder containing 20 mass% or more of tellurium.
(FR) L'invention concerne une pâte conductrice comprenant : une poudre conductrice contenant de l'argent ; une poudre d'indium ; une poudre de verre revêtue d'argent/tellure ; un solvant ; et un liant organique. La poudre de verre revêtue d'argent/tellure comprend une couche de revêtement dont les composants primaires sont l'argent et le tellure et qui est formée sur la surface d'une poudre de verre à base de tellure contenant 20 % en masse ou plus de tellure.
(JA) 銀を含む導電性粉末と、インジウム粉と、銀テルル被覆ガラス粉と、溶剤と、有機バインダーとを含み、前記銀テルル被覆ガラス粉が、テルルを20質量%以上含むテルル系ガラス粉の表面に、銀とテルルを主成分とする被覆層を有する銀テルル被覆ガラス粉である導電性ペーストを提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)