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1. (WO2018047688) RESIN COMPOSITION

Pub. No.:    WO/2018/047688    International Application No.:    PCT/JP2017/031099
Publication Date: Fri Mar 16 00:59:59 CET 2018 International Filing Date: Thu Aug 31 01:59:59 CEST 2017
IPC: C08G 73/14
C08G 69/26
C08G 73/06
C08G 73/10
C08J 5/18
G03F 7/004
G03F 7/023
G03F 7/16
G03F 7/40
Applicants: TORAY INDUSTRIES, INC.
東レ株式会社
Inventors: MASUDA, Yuki
増田 有希
HASHIMOTO, Keika
橋本 啓華
OKUDA, Ryoji
奥田 良治
Title: RESIN COMPOSITION
Abstract:
The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250oC or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.