Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018047597) THERMOSETTING ELECTRICALLY CONDUCTIVE ADHESIVE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/047597 International Application No.: PCT/JP2017/029567
Publication Date: 15.03.2018 International Filing Date: 17.08.2017
IPC:
C09J 201/00 (2006.01) ,C09J 4/02 (2006.01) ,C09J 9/02 (2006.01) ,C09J 11/04 (2006.01) ,C09J 11/06 (2006.01) ,C09J 163/00 (2006.01) ,H01B 1/00 (2006.01) ,H01B 1/20 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
02
Acrylmonomers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
Applicants:
株式会社スリーボンド THREE BOND CO., LTD. [JP/JP]; 東京都八王子市南大沢四丁目3番地3 4-3-3 Minamiosawa, Hachioji-shi, Tokyo 1920398, JP
Inventors:
太田 総一 OTA, Soichi; JP
真舩 仁志 MAFUNE, Hitoshi; JP
加藤 誠 KATO, Makoto; JP
小玉 智也 KODAMA, Tomoya; JP
Agent:
八田国際特許業務法人 HATTA & ASSOCIATES; 東京都千代田区二番町11番地9 ダイアパレス二番町 Dia Palace Nibancho, 11-9, Nibancho, Chiyoda-ku, Tokyo 1020084, JP
Priority Data:
2016-17376506.09.2016JP
Title (EN) THERMOSETTING ELECTRICALLY CONDUCTIVE ADHESIVE
(FR) ADHÉSIF ÉLECTROCONDUCTEUR THERMODURCISSABLE
(JA) 熱硬化型導電性接着剤
Abstract:
(EN) In the past, for many types of thermosetting curable resins, it was difficult to achieve an electrically conductive adhesive that would reduce connection resistance when the adherend was nickel, etc. In addition to reducing connection resistance when the adherend is nickel, etc. for many types of thermosetting curable resins, the present invention makes possible an electrically conductive adhesive for which storage stability is also maintained and which is easy to handle. The present invention is a thermosetting electrically conductive adhesive comprising components (A)-(D): Component (A): curable resin Component (B): thermosetting agent for curing component (A) Component (C): organic metal complex Component (D): electrically conductive particles
(FR) Dans le passé, pour de nombreux types de résines thermodurcissables, il était difficile d'obtenir un adhésif électroconducteur capable de faire baisser la résistance de connexion lorsque la partie adhérée était du nickel, etc. En plus de réduire la résistance de connexion lorsque la partie adhérée est du nickel, etc. pour de nombreux types de résines thermodurcissables, la présente invention rend possible l'obtention d'un adhésif électroconducteur pour lequel la stabilité au stockage est également préservée et qui est facile à manipuler. La présente invention concerne un adhésif électroconducteur thermodurcissable comprenant les composants (A) à (D) : composant (A) : résine durcissable ; composant (B) : agent thermodurcissable pour composant de durcissement (A) ; composant (C) : complexe métallique organique ; composant (D) : particules électroconductrices
(JA) 従来は、被着体がニッケルなどの場合に、多種類の熱硬化型の硬化性樹脂において接続抵抗を低くする導電性接着剤を実現することが困難であった。本発明では、被着体がニッケルなどの場合に、多種類の熱硬化型の硬化性樹脂において接続抵抗を低くすると共に、保存安定性も維持された取扱性が良好な導電性接着剤を可能にする。 本発明は、下記(A)~(D)成分を含む熱硬化型導電性接着剤である; (A)成分:硬化性樹脂 (B)成分:(A)成分を硬化する熱硬化剤 (C)成分:有機金属錯体 (D)成分:導電性粒子。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)