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1. (WO2018047574) LASER BEAM SOURCE AND LASER MACHINING DEVICE USING SAME
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Pub. No.: WO/2018/047574 International Application No.: PCT/JP2017/029062
Publication Date: 15.03.2018 International Filing Date: 10.08.2017
IPC:
B23K 26/00 (2014.01) ,H01S 3/00 (2006.01) ,H01S 3/097 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
3
Lasers, i.e. devices for generation, amplification, modulation, demodulation, or frequency-changing, using stimulated emission, of infra-red, visible, or ultra-violet waves
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
3
Lasers, i.e. devices for generation, amplification, modulation, demodulation, or frequency-changing, using stimulated emission, of infra-red, visible, or ultra-violet waves
09
Processes or apparatus for excitation, e.g. pumping
097
by gas discharge of a gas laser
Applicants:
住友重機械工業株式会社 SUMITOMO HEAVY INDUSTRIES, LTD. [JP/JP]; 東京都品川区大崎2丁目1番1号 1-1, Osaki 2-chome, Shinagawa-ku, Tokyo 1416025, JP
Inventors:
原 章文 HARA, Shobun; JP
Agent:
森下 賢樹 MORISHITA Sakaki; JP
Priority Data:
2016-17473407.09.2016JP
Title (EN) LASER BEAM SOURCE AND LASER MACHINING DEVICE USING SAME
(FR) SOURCE DE FAISCEAU LASER ET DISPOSITIF D'USINAGE LASER L'UTILISANT
(JA) レーザ光源およびそれを用いたレーザ加工装置
Abstract:
(EN) A laser beam source (12) is for use in a laser machining device (10), and oscillates in response to a trigger signal (S1) to generate a laser pulse (6). The laser pulse (6) is radiated by an optical system onto an object (2). A control device (16) outputs the trigger signal (S1) to the laser beam source (12). A drive circuit (60) operates a high frequency power source (50) in response to the trigger signal (S1) and asserts a radiation prohibition signal (S3) if a direct current voltage (VDC) deviates from an allowable range. The laser machining device (10) is configured so as not to radiate the laser pulse (6) onto the object if the radiation prohibition signal (S3) is asserted.
(FR) L'invention porte sur une source de faisceau laser (12) qui est destinée à être utilisée dans un dispositif d'usinage laser (10), et qui oscille en réponse à un signal de déclenchement (S1) pour générer une impulsion laser (6). L'impulsion laser (6) est rayonnée par un système optique sur un objet (2). Un dispositif de commande (16) fournit le signal de déclenchement (S1) à la source de faisceau laser (12). Un circuit d'attaque (60) actionne une source d'énergie haute fréquence (50) en réponse au signal de déclenchement (S1) et affirme un signal d'interdiction de rayonnement (S3) si une tension continue (VDC) s'écarte d'une plage admissible. Le dispositif d'usinage laser (10) est configuré de façon à ne pas rayonner l'impulsion laser (6) sur l'objet si le signal d'interdiction de rayonnement (S3) est affirmé.
(JA) レーザ光源(12)は、レーザ加工装置(10)に使用され、トリガ信号(S1)に応答して発振し、レーザパルス(6)を発生する。レーザパルス(6)は、光学系によって対象物(2)に照射される。制御装置(16)は、レーザ光源(12)に対してトリガ信号(S1)を出力する。駆動回路(60)は、トリガ信号(S1)に応答して高周波電源(50)を動作させるとともに、直流電圧(VDC)が許容範囲から逸脱すると照射禁止信号(S3)をアサートする。レーザ加工装置(10)は、照射禁止信号(S3)がアサートされるとき対象物にレーザパルス(6)を照射しないよう構成される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)