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1. (WO2018047491) ELECTRONIC DEVICE, CAMERA APPARATUS, AND SHIELD CHASSIS
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Pub. No.: WO/2018/047491 International Application No.: PCT/JP2017/026859
Publication Date: 15.03.2018 International Filing Date: 25.07.2017
IPC:
H05K 7/14 (2006.01) ,G03B 17/02 (2006.01) ,H04N 5/225 (2006.01) ,H05K 9/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
14
Mounting supporting structure in casing or on frame or rack
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
B
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17
Details of cameras or camera bodies; Accessories therefor
02
Bodies
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1 Asahicho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
大脇 浩史 OWAKI, Hirofumi; JP
Agent:
山田 英治 YAMADA, Eiji; JP
宮田 正昭 MIYATA, Masaaki; JP
佐々木 榮二 SASAKI, Eiji; JP
澤田 俊夫 SAWADA, Toshio; JP
Priority Data:
2016-17329806.09.2016JP
Title (EN) ELECTRONIC DEVICE, CAMERA APPARATUS, AND SHIELD CHASSIS
(FR) DISPOSITIF ÉLECTRONIQUE, APPAREIL DE CAMÉRA, ET CHÂSSIS DE BLINDAGE
(JA) 電子機器、カメラ装置、並びにシールド・シャーシー
Abstract:
(EN) Provided are an electronic device, a camera apparatus, and a shield chassis with enhanced grounding which are mounted on a vehicle for use. A flexible wiring board 36 comprises an FPC extension portion 41 with a ground pattern portion extending from a terminal portion 40 for electrical connection with a board 31. On an upper-end edge of one wall surface 60 of a shield chassis 16 is formed a clip portion 61 which has a substantially C-shaped cross section and which is provided with an opening portion 62 formed in an upper surface thereof. A tongue portion 52 of the FPC extension portion 41 inserted from the opening portion 62 is pinched by the clip portion 61 and is thereby fixed to the shield chassis 16.
(FR) L’invention concerne un dispositif électronique, un appareil de caméra, et un châssis de blindage à mise à la masse renforcée qui sont embarqués pour être utilisés dans un véhicule. Une carte de circuit imprimé (36) flexible comprend une partie d’extension de FPC (41) dont une partie de motif de masse s’étend depuis une partie de borne (40) pour la connexion électrique avec une carte (31). Sur un bord d’extrémité supérieure d’une surface de paroi (60) d’un châssis de blindage (16) est formée une partie de pince (61) qui a une section transversale sensiblement en forme de C et qui comporte une partie d’ouverture (62) formée dans sa surface supérieure. Une partie de langue (52) de la partie d’extension de FPC (41) insérée depuis la partie d’ouverture (62) est pincée par la partie de pince (61) et est ainsi fixée au châssis de blindage (16).
(JA) 車両に搭載して用いられ、グランドを強化した電子機器、カメラ装置、並びにシールド・シャーシーを提供する。 フレキシブル配線基板36は、基板31側と電気的に接続するための端子部40からグランド・パターン部が延長したFPC延長部41を有する。一方、シールド・シャーシー16の1つの壁面60の上端縁に、断面が略C字形状をなし、上面に開口部62が穿設されたクリップ部61が形成されている。開口部62から挿し込んだFPC延長部41の舌部52が、クリップ部61に挟持されることでシールド・シャーシー16に固定される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)