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1. (WO2018047434) FLEXIBLE PRINTED BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED BOARD

Pub. No.:    WO/2018/047434    International Application No.:    PCT/JP2017/022890
Publication Date: Fri Mar 16 00:59:59 CET 2018 International Filing Date: Thu Jun 22 01:59:59 CEST 2017
IPC: H05K 1/02
H05K 1/03
H05K 3/06
H05K 3/28
Applicants: NIPPON MEKTRON, LTD.
日本メクトロン株式会社
Inventors: EBIHARA, Satoshi
海老原 智
KATO, Takahisa
加藤 高久
SASAKI, Nobuto
佐々木 伸人
AZUMA, Kazuyuki
我妻 和之
SHIMOKAWAJI, Tomohiro
下川路 友博
WAKABAYASHI, Takeo
若林 豪夫
Title: FLEXIBLE PRINTED BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED BOARD
Abstract:
Provided are: a flexible printed board that can improve heat dissipation without using an aluminum heat dissipation material, that is lightweight, that has favorable processing characteristics, and that enables cost reductions; and a method for manufacturing the flexible printed board. This flexible printed board 10 on which a power consuming load is mounted is provided with: a surface heat dissipation layer 30 that is made of a copper foil and has a circuit part on which a load is mounted; a thermally conductive resin layer 20 having a thermal conductivity of at least 0.49 W/mK, wherein the surface heat dissipation layer 30 is laminated on the front surface side of the thermally conductive resin layer; and a rear surface heat dissipation layer that is made of a copper foil, that is laminated on the rear surface side of the thermally conductive resin layer 20, and that has a thickness of 100-400% of that of the surface heat dissipation layer 30.