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|1. (WO2018047434) FLEXIBLE PRINTED BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED BOARD|
|Applicants:||NIPPON MEKTRON, LTD.
|Title:||FLEXIBLE PRINTED BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED BOARD|
Provided are: a flexible printed board that can improve heat dissipation without using an aluminum heat dissipation material, that is lightweight, that has favorable processing characteristics, and that enables cost reductions; and a method for manufacturing the flexible printed board. This flexible printed board 10 on which a power consuming load is mounted is provided with: a surface heat dissipation layer 30 that is made of a copper foil and has a circuit part on which a load is mounted; a thermally conductive resin layer 20 having a thermal conductivity of at least 0.49 W/mK, wherein the surface heat dissipation layer 30 is laminated on the front surface side of the thermally conductive resin layer; and a rear surface heat dissipation layer that is made of a copper foil, that is laminated on the rear surface side of the thermally conductive resin layer 20, and that has a thickness of 100-400% of that of the surface heat dissipation layer 30.