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1. (WO2018047413) OPTICAL COMPONENT MOUNTING DEVICE AND SENSOR DEVICE MANUFACTURING METHOD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/047413    International Application No.:    PCT/JP2017/018564
Publication Date: 15.03.2018 International Filing Date: 17.05.2017
IPC:
H05K 13/04 (2006.01)
Applicants: SHARP KABUSHIKI KAISHA [JP/JP]; 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522 (JP)
Inventors: HIROOKA, Shohgo; (--).
ISHIZUE, Yoshihito; (--).
KURIMOTO, Hideyuki; (--)
Agent: HARAKENZO WORLD PATENT & TRADEMARK; Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041 (JP)
Priority Data:
2016-175760 08.09.2016 JP
Title (EN) OPTICAL COMPONENT MOUNTING DEVICE AND SENSOR DEVICE MANUFACTURING METHOD
(FR) DISPOSITIF DE MONTAGE DE COMPOSANTS OPTIQUES ET PROCÉDÉ DE FABRICATION DE DISPOSITIF CAPTEUR
(JA) 光学部品搭載装置、およびセンサー装置の製造方法
Abstract: front page image
(EN)The present invention enables a high-resolution sensor device to be manufactured. An optical component mounting device (100) is provided with a pressing part (3) that presses an optical component from a suction part (1) side as a result of the stopping of the suction of the suction part (1).
(FR)La présente invention permet la fabrication d’un dispositif capteur à haute résolution. Un dispositif de montage (100) de composants optiques comporte une partie de pression (3) qui presse un composant optique depuis un côté d’une partie d’aspiration (1) suite à l’arrêt de l’aspiration de la partie d’aspiration (1).
(JA)高解像度のセンサー装置の製造を可能とする。光学部品搭載装置(100)は、吸引部(1)による吸引の停止により、吸引部(1)側から光学部品を押圧する押圧部(3)を備えている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)