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1. (WO2018046889) METHOD OF MANUFACTURING THERMOELECTRIC MODULE USING INK FORMULATIONS

Pub. No.:    WO/2018/046889    International Application No.:    PCT/GB2017/052515
Publication Date: Fri Mar 16 00:59:59 CET 2018 International Filing Date: Wed Aug 30 01:59:59 CEST 2017
IPC: H01L 51/00
H01L 35/24
H01L 35/34
Applicants: CAMBRIDGE DISPLAY TECHNOLOGY LIMITED
SUMITOMO CHEMICAL COMPANY LIMITED
Inventors: FLETCHER, Thomas
Title: METHOD OF MANUFACTURING THERMOELECTRIC MODULE USING INK FORMULATIONS
Abstract:
A method of manufacturing a conductive layer includes the step of dissolving an organic semiconductor polymer in a first solvent, the first solvent being an aromatic or heterocyclic compound comprising one or more electron-rich carbon atom(s) and/or heteroatom(s). The method also includes dissolving a dopant in a second solvent, the second solvent being a polar solvent. The method also includes mixing the solutions of the organic semiconductor polymer and the dopant to form a dispersion comprising doped conductive polymer particles suspended in the solvent blend. The method also includes depositing the dispersion by a solution deposition technique to form a conductive layer. The solution deposition technique is preferably an inkjet printing, dispense printing or drop casting method. The dispersion provides a stable ink composition for the manufacturing of thick and uniform layers with excellent conductivity and thermopower, and allows simple fabrication of thermoelectric legs with enhanced performance.