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1. (WO2018046627) METHOD FOR PROCESSING A SUBSTRATE USING A PUNCH
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/046627 International Application No.: PCT/EP2017/072523
Publication Date: 15.03.2018 International Filing Date: 07.09.2017
IPC:
B26F 1/44 (2006.01) ,B23K 20/10 (2006.01) ,G06K 19/07 (2006.01) ,B26D 7/27 (2006.01) ,B26D 7/08 (2006.01) ,B26D 7/01 (2006.01) ,G06K 19/00 (2006.01) ,B26D 5/02 (2006.01) ,B26D 1/00 (2006.01) ,B42D 25/40 (2014.01)
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
F
PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
1
Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
38
Cutting-out; Stamping-out
44
Cutters therefor; Dies therefor
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
10
making use of vibrations, e.g. ultrasonic welding
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
D
CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
7
Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
27
Means for performing other operations combined with cutting
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
D
CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
7
Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
08
Means for treating work or cutting member to facilitate cutting
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
D
CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
7
Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
01
Means for holding or positioning work
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
D
CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
5
Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
02
Means for moving the cutting member into its operative position for cutting
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
D
CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
1
Cutting through work characterised by the nature or movement of the cutting member; Apparatus or machines therefor; Cutting members therefor
[IPC code unknown for B42D 25/40]
Applicants:
BUNDESDRUCKEREI GMBH [DE/DE]; Kommandantenstraße 18 10969 Berlin, DE
Inventors:
DR. BAUDACH, Steffen; DE
VON CZAPIEWSKI, Christoph; DE
GÖDECKE, Alexander; DE
HERES, Roland; DE
STRAUB, Alexander; DE
Agent:
RICHARDT PATENTANWÄLTE PARTG MBB; Wilhelmstraße 7 65185 Wiesbaden, DE
Priority Data:
10 2016 217 044.907.09.2016DE
Title (EN) METHOD FOR PROCESSING A SUBSTRATE USING A PUNCH
(FR) PROCÉDÉ DE TRAITEMENT D'UN SUBSTRAT AU MOYEN D'UN POINÇON
(DE) VERFAHREN ZUR BEARBEITUNG EINES SUBSTRATS MIT EINEM STANZSTEMPEL
Abstract:
(EN) The invention relates to a method for processing a substrate (100) using a punch, the substrate (100) extending at least partially in a plane (206), wherein the method comprises the following steps: an opening (208) is punched out in the part of the substrate (100) extending in the plane (206) using the punch, wherein, during the punching process, the punch (204) is in a first punching position relative to the plane (206); after the punching process, the punch (204) and the substrate (100) are made to carry out a relative movement in a direction parallel to the plane (206), wherein, as a result of the relative movement, the punch (204) is positioned over a desired filling material (202) in a second punching position relative to the plane (206); in the second punching position, a filling element (102) is punched out from the desired filling material (202) using the punch, the filling element (102) remaining in the punch (204); the punch (204) and the substrate (100) are made to carry out another relative movement in a direction parallel to the plane (206), wherein, as a result of the relative movement, the punch (204) is positioned over the opening (208) in the substrate (100) in the first punching position relative to the plane (206); the filling element (102) remaining in the punch (204) is inserted into the opening (208) of the substrate (100) using the punch (204).
(FR) L'invention concerne un procédé de traitement d'un substrat (100) au moyen d'un poinçon, le substrat (100) s'étendant, au moins partiellement, dans un plan (206), ledit procédé comprenant les étapes suivantes : le poinçonnage d'une ouverture (208) dans la partie du substrat (100) s'étendant dans le plan (206), au moyen du poinçon, le poinçon (204) étant situé, lors du poinçonnage, observé dans la direction du plan (206), dans une première position de poinçonnage ; après le poinçonnage, la réalisation d'un mouvement relatif du poinçon (204) et du substrat (100), dans une direction parallèle au plan (206), le poinçon (204), en raison du mouvement relatif dans la direction du plan (206), étant situé sur un matériau de remplissage déterminé (202), dans une deuxième position de poinçonnage ; dans la deuxième position de poinçonnage, le poinçonnage d'un élément de remplissage (102), à partir du matériau de remplissage souhaité (202), au moyen du poinçon, l'élément de remplissage (102) restant dans le poinçon (204) ; la réalisation d'un nouveau mouvement relatif du poinçon (204) et du substrat (100), dans une direction parallèle au plan (206), le poinçon (204), en raison du mouvement relatif, observé dans la direction du plan (206), étant situé au-dessus de l'ouverture (208) du substrat (100), dans la première position de poinçonnage ; l'insertion de l'élément de remplissage (102), restant dans le poinçon (204), à l'aide du poinçon (204), dans l'ouverture (208) du substrat (100).
(DE) Die Erfindung betrifft ein Verfahren zur Bearbeitung eines Substrats (100) mit einem Stanzstempel, wobei sich das Substrat (100) zumindest teilweise in einer Ebene (206) erstreckt, wobei das Verfahren umfasst: - Ausstanzen einer Öffnung (208) in dem sich in der Ebene (206) erstreckenden Teil des Substrats (100) durch den Stanzstempel, wobei sich der Stanzstempel (204) beim Ausstanzen in Richtung der Ebene (206) gesehen in einer ersten Stanzposition befindet, - Nach dem Ausstanzen, Durchführen einer Relativbewegung von Stanzstempel (204) und Substrat (100) in einer Richtung parallel zu der Ebene (206), wobei aufgrund der Relativbewegung in Richtung der Ebene (206) gesehen der Stanzstempel (204) übereinem gewünschten Füllmaterial (202) in einer zweiten Stanzposition zu liegen kommt, - In der zweiten Stanzposition, Ausstanzen eines Füllelements (102) aus dem gewünschten Füllmaterial (202) durch den Stanzstempel, wobei das Füllelement (102) in dem Stanzstempel (204) verbleibt, - Erneutes Durchführen einer Relativbewegung von Stanzstempel (204) und Substrat (100) in einer Richtung parallel zu der Ebene (206), wobei aufgrund der Relativbewegung in Richtung der Ebene (206) gesehen der Stanzstempel (204) über der Öffnung (208) des Substrats (100) in der ersten Stanzposition zu liegen kommt, - Einsetzen des in dem Stanzstempel (204) verbliebenen Füllelements (102) durch den Stanzstempel (204) in die Öffnung (208) des Substrats (100).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)