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1. (WO2018045282) EMULSIONS, TREATMENT FLUIDS AND METHODS FOR TREATING SUBTERRANEAN FORMATIONS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/045282 International Application No.: PCT/US2017/049845
Publication Date: 08.03.2018 International Filing Date: 01.09.2017
IPC:
C09K 8/04 (2006.01) ,C09K 8/12 (2006.01) ,C09K 8/26 (2006.01) ,C09K 8/28 (2006.01) ,C09K 8/36 (2006.01) ,C09K 8/68 (2006.01) ,C09K 8/88 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
8
Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
02
Well-drilling compositions
04
Aqueous well-drilling compositions
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
8
Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
02
Well-drilling compositions
04
Aqueous well-drilling compositions
06
Clay-free compositions
12
containing synthetic organic macromolecular compounds or their precursors
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
8
Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
02
Well-drilling compositions
04
Aqueous well-drilling compositions
26
Oil-in-water emulsions
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
8
Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
02
Well-drilling compositions
04
Aqueous well-drilling compositions
26
Oil-in-water emulsions
28
containing organic additives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
8
Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
02
Well-drilling compositions
32
Non-aqueous well-drilling compositions, e.g. oil-based
36
Water-in-oil emulsions
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
8
Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
60
Compositions for stimulating production by acting on the underground formation
62
Compositions for forming crevices or fractures
66
Compositions based on water or polar solvents
68
containing organic compounds
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
8
Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
60
Compositions for stimulating production by acting on the underground formation
84
Compositions based on water or polar solvents
86
containing organic compounds
88
macromolecular compounds
Applicants:
KEMIRA OYJ [FI/FI]; Porkkalankatu 3 FI-00180 Helsinki, FI
Inventors:
TELLAKULA, Roopa; US
Agent:
SMYTHE, Nicole; US
Priority Data:
62/382,34701.09.2016US
Title (EN) EMULSIONS, TREATMENT FLUIDS AND METHODS FOR TREATING SUBTERRANEAN FORMATIONS
(FR) ÉMULSIONS, FLUIDES DE TRAITEMENT, ET PROCÉDÉS DE TRAITEMENT DE FORMATIONS SOUTERRAINES
Abstract:
(EN) Emulsions, treatment fluids and methods for treating subterranean formations are provided, wherein the emulsions comprise water, a water-immiscible liquid, one or more polymers, and an inverting surfactant composition comprising one or more surfactants selected from the group consisting of ethoxylated amine compounds, ethoxylated fatty acid compounds, and alkyl polyethyleneglycol ether carboxylic acid compounds, alkyl polyglycol ether carboxylic acid compounds, and salts or esters thereof. The emulsions are particularly suitable for use in brine.
(FR) L'invention concerne des émulsions, des fluides de traitement et des procédés de traitement de formations souterraines, les émulsions comprenant de l'eau, un liquide non miscible à l'eau, un ou plusieurs polymères et une composition tensioactive à effet d'inversion, comprenant un ou plusieurs tensioactifs choisie dans le groupe consistant en les composés amines éthoxylées, les composés acides gras éthoxylés, et les composés acides alkyl polyéthylèneglycol éther carboxyliques, les composés acides alkyl polyglycol éther carboxyliques, et les sels ou esters de ces derniers. Les émulsions conviennent particulièrement à une utilisation dans une saumure.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)