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1. (WO2018045039) POLISHING SYSTEM WITH ANNULAR PLATEN OR POLISHING PAD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/045039 International Application No.: PCT/US2017/049394
Publication Date: 08.03.2018 International Filing Date: 30.08.2017
IPC:
B24B 37/04 (2006.01) ,B24B 37/20 (2012.01) ,B24B 57/02 (2006.01) ,H01L 21/306 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
04
designed for working plane surfaces
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
11
Lapping tools
20
Lapping pads for working plane surfaces
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
57
Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
02
for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306
Chemical or electrical treatment, e.g. electrolytic etching
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors:
BUTTERFIELD, Paul D.; US
OSTERHELD, Thomas H.; US
OH, Jeonghoon; US
CHANG, Shou-Sung; US
ZUNIGA, Steven M.; US
REDEKER, Fred C.; US
Agent:
GOREN, David J.; US
Priority Data:
62/382,09731.08.2016US
62/445,37112.01.2017US
Title (EN) POLISHING SYSTEM WITH ANNULAR PLATEN OR POLISHING PAD
(FR) SYSTÈME DE POLISSAGE À PLATEAU OU TAMPON À POLIR ANNULAIRE
Abstract:
(EN) A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is suspended and which is configured to move the hold the carrier head laterally across the polishing pad, and a controller. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen, and the inner edge of the annular polishing pad is positioned around the axis of rotation. The controller is configured to cause the support structure to position the carrier head such that a portion of the substrate overhangs the inner edge of the annular polishing pad while the substrate is contacting the polishing pad.
(FR) Un système de polissage comprend un plateau comportant une surface supérieure, un tampon à polir annulaire supporté sur le plateau, une tête de support destinée à maintenir un substrat en contact avec le tampon à polir annulaire, une structure de support à partir de laquelle la tête de support est suspendue et qui est conçue pour déplacer la tête de support latéralement à travers le tampon à polir, et un dispositif de commande. Le plateau peut tourner autour d'un axe de rotation qui passe approximativement au centre du plateau, et le bord interne du tampon à polir annulaire est positionné autour de l'axe de rotation. Le dispositif de commande est configuré pour amener la structure de support à positionner la tête de support de sorte qu'une partie du substrat surplombe le bord interne du tampon à polir annulaire alors que le substrat est en contact avec le tampon à polir.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)