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1. (WO2018044706) HIGH-POWER LASER PACKAGING UTILIZING CARBON NANOTUBES

Pub. No.:    WO/2018/044706    International Application No.:    PCT/US2017/048576
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Sat Aug 26 01:59:59 CEST 2017
IPC: H01S 5/022
H01S 5/18
H01S 5/00
Applicants: TERADIODE, INC.
Inventors: DEUTSCH, Michael
LIU, Zhongyong
LEE, Won, Tae
Title: HIGH-POWER LASER PACKAGING UTILIZING CARBON NANOTUBES
Abstract:
In one embodiment, laser devices include a thermal bonding layer, wherein the thermal bonding layer comprises an array of carbon nanotubes, a first metallic bonding material disposed between the array of carbon nanotubes and a beam emitter, and a second metallic bonding material disposed between the array of carbon nanotubes and a first electrode mount.